Electronics Forum | Sat May 16 13:14:07 EDT 2009 | pioneerdietecs
Pioneer-Dietecs Corporation makes depaneling dies and singulating presses. We make dies that can be used in a Wand press too. Visit http://www.pioneerdietecs.com for more information. Or send an email to larson@pioneerdietecs.com with a CAD file or p
Electronics Forum | Tue Jul 24 17:54:14 EDT 2012 | tombstonesmt
Anyone placing any type of masking material die cuts with SMT equipment? We currently manually place a enormous amount of polymide 1/4 inch dots. Looking into automating this process. We already place 2d labels so doesn't seem to far fetched. Any sug
Electronics Forum | Mon Mar 11 10:43:06 EDT 2019 | herve53
Hello, Is somebody could support me ? I would like to understand what is the chip on board process. What are process steps to produce a die in COB ?(please with technical details) (from start of the line to end of the production line, cleaning, pick
Electronics Forum | Tue Oct 20 10:57:18 EDT 1998 | Craig Ramsey
Dear Bob, The Tessera microBGA technology defines a family of CSP devices. The most common microBGA type is the TV46 that has been selected by Intel for use with their flash memory devices. A microBGA package in general consists of the silicon die
Electronics Forum | Tue Jul 18 11:50:26 EDT 2000 | Jeff Sanchez
Hey all, My brother is a tech at TI. He is running tests on bump dies. The question is if he heats up a die (actual waffer) with out disrupting the solder can he still use the solder. Will the solder lose its integrity? Keep in mind that these
Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Mon Sep 14 16:44:37 EDT 1998 | Steve A
| Reading some technical report I found the term "CSP", but no explanation. | I guess something about Chip Scale Package... but not sure. | Could someone please explain it to me? | Rgds, | Anderson You are absolutely correct. CSP is an acronym for C
Electronics Forum | Fri Apr 17 14:08:44 EDT 1998 | Earl Moon
| Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else | have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare
Electronics Forum | Tue Oct 30 17:16:24 EST 2001 | seand
Hello Chris, If you could humor me, what are the limiting factors forcing your dot size to .010"? What is the die size that you are placing? What are the accuracy tolerances? Was eutectic die attach never an option for this bare die? Have you de
Electronics Forum | Mon Jul 11 12:42:46 EDT 2005 | machine designer
I need a good digital photo or two of the turret of a Siplace (or equiv) style SMD pick and place head preferably laden with die or SMD parts to explain a bulk handling concept to some machine neophytes here. I could alternatively use an image of any
