Electronics Forum | Tue Jun 27 21:29:05 EDT 2000 | darren burchill
Mike: You called it GOOP, and I agree with you. The closeset we came to the daphne was alvania but it is not great stuff either. I am now trying some stuff called PERMALUBE madae by Certified Labs. They assure me that it meets or exceeds fuji specs
Electronics Forum | Thu Jan 20 16:06:38 EST 2000 | Mike Naddra
Regarding glass transition , does anyone have expierance glass wiht transition temperature specification , such as what are the detrimental effects of exceeding the Tg , how long over the glass transition temperature ,if any , is acceptable. Tg of di
Electronics Forum | Sun Apr 25 11:44:14 EDT 1999 | Earl Moon
| | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are usi
Electronics Forum | Wed Jan 30 17:49:41 EST 2002 | davef
PCB never expire, they just become more difficult to solder. [Many shops impose �shelf life� periods for their boards, but they aren�t going to discard the boards if the exceed the limits, unlike they would with some other process materials.] IDENT
Electronics Forum | Tue May 14 14:02:13 EDT 2002 | Hussman69
It all depends on the part you're cooking. Most components have a storage recommendation in their spec sheet. So be sure not to exceed it. Generally I see a lot of spec sheets that are arounf 140 C. So I set the oven for about 100 C and let it go
Electronics Forum | Thu Jun 06 15:52:38 EDT 2002 | dason_c
It is normal recommended by the paste supplier. Indium paste claim that it can worked on high temp/RH area. Also, check Aim solder web site and they have a good solder paste handling guideline. Internally, we control our environment not exceed 27C
Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef
You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a
Electronics Forum | Thu Oct 24 01:10:54 EDT 2002 | pizz
thank ur kind help. the above two processes,which is more reliably,other words,robust? I am in a dilemma. some suggest that 50 pins is the critical point,once exceed the quantity,the hand soldering is not practical. I prefer to two sides reflow.but
Electronics Forum | Mon Nov 03 11:58:16 EST 2003 | John
Can anyone recommend a few dry box manufacturers? We are just now getting into moisture sensitive devices. Are there any specific differences in these products to watch our for? The parts we will be using are rated as level 4 in sensitivity. Can
Electronics Forum | Tue Jun 01 19:35:39 EDT 2004 | Ken
There are studies out there that looked at gold embrittlement. The overall consensus is to not exceed 5% by weight. As far as the conductivity question, as themo/mechanical creep fatigue sets in, your conductivity will be affected as the joint is s
