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Risho Ricocel Sheet For  SMT PCBA  Fixture Jig

Risho Ricocel Sheet For SMT PCBA Fixture Jig

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Trade names: Ricocel Similar Wave Solder Pallet Material, Carbon Fiber Glass Reinforced Sheet Available Shapes: Sheet Color: Black Sheets Thickness: 3mm ~ 80mm Size: 1010×1010mm, 1210×1010mm About Ricocel Similar Wave Solder Pallet Material: It is

http://www.energetic-industry.com

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

Technical Library | 2020-05-07 03:46:27.0

The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.

SELECT Products | Nordson Electronics Solutions

Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Technical Library | 2022-08-08 15:06:06.0

Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.

Hentec Industries, Inc. (RPS Automation)

InsulFab PCB Tooling

Industry Directory | Consultant / Service Provider

InsulFab is the leader in PCB Tooling with 2 locations and unmatched engineering support we will provide the custom solution

Cathcart & Merriman, Inc.

Industry Directory | Manufacturer's Representative

Manufacturing Representative serving North Carolina, South Carolina, and Virginia.

Alternative Ricocel Sheet

Alternative Ricocel Sheet

New Equipment | Materials

Alternative Ricocel, Lead-free Sheet is epoxy glass fabric laminates material which is highly stable at high temperature of lead free solder and flux chemicals. Same as wave solder pallet material ES-3261A. It is another kindly of excellent material

ChangDa Composite Materials Manufacturing Co.,Ltd

Alternative Ricocel Sheet

Alternative Ricocel Sheet

New Equipment | Materials

Alternative Ricocel, Lead-free Sheet is epoxy glass fabric laminates material which is highly stable at high temperature of lead free solder and flux chemicals. Same as wave solder pallet material ES-3261A. It is another kindly of excellent material

ChangDa Composite Materials Manufacturing Co.,Ltd

Headway automatic technology

Industry Directory | Consultant / Service Provider / Manufacturer

We provide following product to Factory: 1. PCB Functional test equipment(FCT/ATE/ICT) 2. Wave Solder Pallets 3. Tooling 4. HDMI/VGA/DVI/CVBS&Ypbpr/LVDS signal generator 5. Needle Bed

Black ESD Ricocel Sheet with Long Life Cycles

Black ESD Ricocel Sheet with Long Life Cycles

New Equipment | Selective Soldering

Black ESD Ricocel Sheet with Long Life Cycles Ricocel is made by fiber glass cloth and high temperature resin. It is an ideal material for solder pallets, wave solder pallets, SMT solder pallets, SMT solder fixtures, selective solder fixtures and ot

Prior Plastic Co., LTD.

Black Anti-Static Material Ricocel Sheet for PCB Jig

Black Anti-Static Material Ricocel Sheet for PCB Jig

New Equipment | Materials

Black Anti-Static Material Ricocel Sheet for PCB Jig Ricocel is made by fiber glass cloth and high temperature resin. It is an ideal material for solder pallets, wave solder pallets, SMT solder pallets, SMT solder fixtures, selective solder fixtures

Prior Plastic Co., LTD.


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Selective soldering solutions with Jade soldering machine

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