Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef
A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta
Electronics Forum | Tue May 01 20:40:38 EDT 2018 | sarason
In the past I have worked on 600 Amp FET Blocks. The rule was no voids. The circuit board would be heavy copper. 4 times normal plating time. Not particularly high resolution on the board say 20 mils. To help with the heavy plating. The boards were t
Electronics Forum | Wed Jan 15 11:53:40 EST 2020 | avillaro2020
As far as the large thermal gradient I have on my thick and thermal heavy board, I've done quite a bit to minimize the gradient but not successful. it's like one pad is connected to a signal while the other pad is connected to ground, you can't bring
Electronics Forum | Tue Nov 07 14:31:01 EST 2000 | John
My company manufactures a board for a heavy duty automotive application. One of the through hole parts on the board dissipates enough heat that it requires high temp solder. Does anyone know of or have experience with a high quality selective solde
Electronics Forum | Sun Jan 23 09:24:11 EST 2000 | M Cox
I have had good luck buying after market nozzles from SMT research. Fuji CP3 Nozzles, I bought the Heavy-duty version and they lasted 3 times longer than OEM Nozzles. SMT Research buy's their Panasonic nozzles from the same source as Panasonic does
Electronics Forum | Tue Dec 21 00:10:00 EST 1999 | Edmund
Currently i am producing a board using dloble reflow process. The bottom side is mostly 0603 chips and some SOIC. The top side is mostly QFP and some heavy component. During the double reflow process , the capacitor chip on the bottom side drop(same
Electronics Forum | Mon Jun 17 15:25:10 EDT 2002 | lysik
I would look at Universal for sure. They have a ton of late model Chip placer's and GSM's that they will discount heavy. There are so many used GSM's and HSP's on the market you could probably get what you need for a fraction of the cost. You could p
Electronics Forum | Thu Oct 24 01:10:54 EDT 2002 | pizz
thank ur kind help. the above two processes,which is more reliably,other words,robust? I am in a dilemma. some suggest that 50 pins is the critical point,once exceed the quantity,the hand soldering is not practical. I prefer to two sides reflow.but
Electronics Forum | Fri Oct 18 22:32:20 EDT 2002 | mdm4ua
If you have room try putting a small piece of tape on the bottom of the stencil right next the aperture that is giving you the problem. The added height of the tape (Kapton tape is usually about 3 mils thick) will likely give you a heavy enough depo
Electronics Forum | Mon Dec 09 08:13:06 EST 2002 | MA/NY DDave
Hi Yes it is common to design for more uniform heat transfer during the soldering phase or even during the operation phase. It all depends on how bad the problem is during automated assembly or during usage. The only difficulty is that the designer
