Electronics Forum | Mon May 07 09:47:45 EDT 2001 | orbotech
An ultimate truth in AOI is that "you can not avoid what you can not see". At the post solder stage, 2D inspection is typically not enough as it simply "can not see" everything using a single perspective, and therefore, can not detect all of the faul
Electronics Forum | Mon Jul 20 12:39:11 EDT 2009 | bigdaddysoy9
Hello Reese, Lifted leads are and have always been a big concern for us. We were using a system that had 12 cameras total. 8 angled and 4 top-down. I could not get that to catch lifted leads without having a ton of false calls. I thought that may
Electronics Forum | Fri Jul 24 03:09:14 EDT 2009 | fede
We have one YesTech F1 working and a second one purchased on the way. So far, in my half year experience with it, we check solder and lifted leads with TOP cameras. The only ocations I use side cameras are when I have to inspect odd components that
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
Electronics Forum | Wed Jan 27 17:32:51 EST 2016 | billthebuilder
We do High Mix, Low Volume and are looking for the best inline AXI with the criteria of industry-leading automation capabilities. The abilities to program offline, automatic conveyor width adjustment and board alignment are important to us. We want t
Electronics Forum | Tue Jan 13 20:52:21 EST 2004 | davef
Bismuth Solder alloys * Fatigue life is reduced when soldered to hot air solder leveled (HASL) boards. * Lead from Hot Air Leveling (HAL) coatings can diffuse through the grain boundaries of alloy. * Lead is bismuth alloys can form a eutectic composi
Electronics Forum | Mon Sep 11 20:35:28 EDT 2000 | Dave F
Charlie: What takes longer? 1 Forming component leads to prevent lifting 2 Placing a bag of pellets on the board, waving the board, taking the bag off the board, straightening the components, returning the bag to the front of the wave, etc, etc Goo
Electronics Forum | Wed Jun 06 02:57:37 EDT 2001 | kyaw
I have a problem run in Burn-in-Board that the sockets lead are deform and lifted about 6 mil to 10 mil from PCBA. Anybody can inform to me for this problem. Thank you
Electronics Forum | Mon Dec 22 12:41:17 EST 2003 | Marc Simmel
No clean solder paste. One further observation ... the parts have a metal shell and are 'floating' high on the paste. Though there is wetting on the metal shell, it doesn't seem to sink as far as it should and this could be lifting the soldertails f
Electronics Forum | Thu Mar 09 04:04:48 EST 2006 | dougs
one point to remember is to have a large stencil reduction on the thermal pad, you need to reduce the solder volume by about 35%, if you don't you risk the solder from the thermal pad shorting out the other leads or the solder volume causing the comp
