Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
New Equipment | Board Handling - Storage
Eureka XDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-2001 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, 1 M ω Ground Wire Capacity: 1314 L
New Equipment | Board Handling - Storage
Eureka Dry Tech XDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://www.eurekadrytech.com/fast-super-dryer/xdc-1001 Capacity: 657 Liters Humidity Range: LESS THAN 5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after acce
New Equipment | Rework & Repair Equipment
Rapid, Safe Soldering or Desoldering on High Mass, Heat-Sinking Assemblies Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's and
.jpg)
Parts & Supplies | Pick and Place/Feeders
Hot sell JUKI 750 760 4 WAY ELECTROMAGNETIC VALVE PV140507000 VQD1121W-5MO-C4-X8B Original new Supply all juki spare parts at low price JUKI E3701715000 VCS BASE www.fujintai.com JUKI E3701721000 VCS CAMERA BRACKET A FUJINTAI TECHNOLOGY CO.,LT
.jpg)
Parts & Supplies | Pick and Place/Feeders
Hot sell JUKI CERAMIC CIRCUIT BOARD JIG V002 E2107998000 Original new Supply all juki spare parts at low price JUKI ESS16048100 TACTILE MOTOR 1001935 FUJINTAI TECHNOLOGY CO.,LTD JUKI ESS16049100 Z MOTOR www.fujintai.com JUKI ESS16050100 TRAC
Technical Library | 2019-02-20 16:35:24.0
The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df electrical test results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre-lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion.
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
Industry News | 2017-06-07 11:51:15.0
Isola Group, the leading global and local manufacturer of copper-clad laminates and dielectric prepregs for use in the PCB boards announces it will exhibit at the IMS Exhibition June 6-8, 2017 at the Hawai’i Convention Center in Honolulu, Hawaii. Isola will display in booth #1008.
New Equipment | Board Handling - Storage
Eureka TD-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/td-101 Model: TD-101 Fast Super Dryer Capacity: 93 Liters Humidity Range: LESS THAN 20% Recovery Time: Recovers to ≤ 20% RH within 3
