Electronics Forum: microbga (Page 7 of 14)

Re: Micro-BGA soldering

Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon

| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F

Re: Micro-BGA soldering

Electronics Forum | Mon Jul 26 18:05:18 EDT 1999 | ScottM

| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory

| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 01:20:22 EDT 2005 | Frank

Are you sure about your dimensions? .45mil ball diameter and .8mil pitch, and a body size of 16x8mils is really, really tiny. I assume you mean millimeters and not mils? 1mil = 0.0254millimeters If your stencil is 5mils and your ball diameter is

Re: uBGA's

Electronics Forum | Fri May 14 17:06:18 EDT 1999 | Ryan Jennens

| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre

Re: uBGA's

Electronics Forum | Fri May 14 17:06:29 EDT 1999 | Ryan Jennens

| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon

| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con

SRT Rework Station, Model FPD-W

Electronics Forum | Thu Feb 17 16:55:50 EST 2000 | Brian Husnik

I am evaluating the purchase of a used SRT Rework Station, Model # 'FPD-W', and would like to hear from anyone who has any experience, thoughts, comments or suggestions regarding this station. We will be using the station for removal and placement o

Re: APerture size for microBGA

Electronics Forum | Fri Jun 30 10:42:24 EDT 2000 | Chrys Shea

That pad had a 16 mil dia, so I arrived at 20 mil squares by adding 2 mils to each side of the pad. Following that logic, a 12 mil pad would use a 16 mil square. But a 12 mil pad is on a finer pitch that isn't mentioned, so you should definitely

SRT Rework Station, Model FPD-W

Electronics Forum | Thu Feb 17 16:55:50 EST 2000 | Brian Husnik

I am evaluating the purchase of a used SRT Rework Station, Model # 'FPD-W', and would like to hear from anyone who has any experience, thoughts, comments or suggestions regarding this station. We will be using the station for removal and placement o


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