Electronics Forum | Thu Nov 12 11:16:55 EST 1998 | Dave F
| | | I have a need to dispense a latex masking material using an automated dispensing system. We are presently looking at the I&J750. Does anyone have any experience with this piece of equipment, or have a better solution available? | | | | | Dou
Electronics Forum | Fri Nov 13 10:25:11 EST 1998 | Doug Clement
| | | | I have a need to dispense a latex masking material using an automated dispensing system. We are presently looking at the I&J750. Does anyone have any experience with this piece of equipment, or have a better solution available? | | | | | |
Electronics Forum | Fri Apr 17 14:03:48 EDT 1998 | Earl Moon
| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu
Electronics Forum | Wed Jan 06 23:01:48 EST 1999 | Dave F
| | Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socke
Electronics Forum | Wed Jan 06 21:56:37 EST 1999 | Steve Gregory
| Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socket
Electronics Forum | Wed Jun 03 15:22:12 EDT 1998 | Greg Curler
| | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not
Electronics Forum | Wed Apr 03 19:02:16 EDT 2019 | SMTA-Vikram
We still use Via as test points. so we need to paste Via. Pasting will make better contact with probes compare to test via without solder.
Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite
Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process
Electronics Forum | Wed Sep 20 10:42:05 EDT 2000 | Erick Russell
Process control for Photonic soldering is based on the actual temperature of the component being reworked. If the desired temperature of the component for your process is 200C then that is the process temperature programmed. This is achieved by a cl
Electronics Forum | Sun Feb 15 10:47:16 EST 1998 | SMT-ASSY
In reference to your Email response, we will propose to you in the next few days a course curriculum which we hope you will find of great interest. As we told you we offer courses for assemblers and techs in PTH, SMT soldering, SMT full process using
