Full Site - : ramp to spike (Page 7 of 22)

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

Pulse Electronics' ProxAnt TL 1.0 Package Combines a Proximity Sensor with an Antenna to Optimize both Functions

Industry News | 2015-12-16 18:26:09.0

Pulse Electronics Corporation introduces an all-in-one combination antenna and proximity sensor package to optimize the characteristics of both functions, thus enabling better device performance and increased design flexibility for tablets, laptops, and notebook computers. The ProxAnt TL 1.0 is a seven band main antenna, a proximity sensor chip, and all needed components included on the same flexible circuit board. Without requiring physical contact, the sensor recognizes when it is close to the user and sends a signal to the host processor to reduce the transmission power to the antenna, thus lowering SAR. The sensor also recognizes movement to avoid a false trigger.

Pulse Electronics

Data I/O to Showcase the New ConneXTM Smart Programming Software for Automotive and Smart Factory Initiatives at IPC APEX EXPO

Industry News | 2017-02-08 17:57:50.0

Data I/O Corporation will showcase the new ConneXTM smart programming software for PSV systems in Booth #2741 at the IPC APEX EXPO, scheduled to take place February 14th – 16th at the San Diego Convention Center in San Diego, CA.

Data I/O Corporation

Data I/O to Showcase the New ConneXTM Smart Programming Software for Smart Factory of Electronics Manufacturing at NEPCON CHINA

Industry News | 2017-04-24 19:14:12.0

Data I/O Corporation will showcase the new ConneXTM smart programming software for PSV systems in Booth #A-1H01 at NEPCON CHINA, scheduled to take place April 25th-27th at Shanghai world EXPO exhibition and convention center.

Data I/O Corporation

Nordson DIMA Launches New Website to Promote Hot Bar Soldering and Bonding Capabilities for the Electronics Industry

Industry News | 2017-07-17 19:09:09.0

Nordson DIMA has launched a new web site, www.nordsondima.com. The newly designed site makes it easier for visitors to learn about Nordson DIMA's full line of hot bar reflow soldering, heat seal bonding, ACF laminating, and heat staking solutions. A second website, www.dimadispensing.eu, was updated to cover the dispensing product lines that are exclusively available for the European region.

C-Tech Systems, B.V. [formerly Nordson DIMA]

Nordson DIMA hot bar soldering solutions, fluid dispensing, and coating systems to be demonstrated at SMT Hybrid 2018

Industry News | 2018-06-04 18:24:29.0

Nordson DIMA, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit a range of products for hot bar soldering, as well as fluid dispensing and coating systems, at SMT Hybrid 2018 in Nuremberg, Germany, June 5-7, 2018, in the AAT Aston GmbH stand, Hall 4, booth 241.

C-Tech Systems, B.V. [formerly Nordson DIMA]

Nordson DIMA to Demonstrate Hot Bar Reflow Soldering and Automated Flux Dispensing with the C-TurnFlux System at IPC APEX Expo 2019

Industry News | 2019-01-16 09:48:30.0

Nordson DIMA will exhibit its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering, at the IPC APEX Expo, San Diego, CA - its first live demonstration in North America. The C-TurnFlux combines both high output and quality, using high-speed product handling and guaranteed position repeatability for mission-critical assembly applications.

C-Tech Systems, B.V. [formerly Nordson DIMA]

Data I/O to Showcase SentriX™Security Provisioning Technology and ConneXTM Smart Programming Software for Automotive Applications and Smart Factory Initiatives at productronica

Industry News | 2017-10-18 19:54:28.0

Data I/O Corporation will showcase the new SentriX™ Security Provisioning Technology and ConneXTM smart programming software at the international productronica trade show November 14th- 17th in Munich, Germany at Hall A2, Booth 205.

Data I/O Corporation

BTU International’s TRITAN™ HV90 Dual-Lane Metallization Firing System Successfully Completes Marathon Test

Industry News | 2011-12-12 17:08:11.0

BTU International announces that its TRITAN™ HV90 dual-lane metallization firing system has successfully completed a marathon test, producing in excess of 60 million cells.

BTU International

BTU International's TRITAN™ HV90 Metallization Firing System Exceeds Industry Specification for Yield

Industry News | 2011-12-19 17:10:27.0

BTU International announces that its TRITAN™ HV90 dual-lane metallization firing system exceeds industry standards for wafer breakage. The three-belt, three-speed system boasts a yield better than 99.99%, exceeding the industry standard for metallization firing.

BTU International


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