Electronics Forum: singulate (Page 7 of 7)

Re: Depanelization of PCBs

Electronics Forum | Mon Jun 22 21:31:43 EDT 1998 | Dave F

| Dear collegues, | I like to have your comments/ experience with various methods of depanelization like routing, scoring, cutting etc. | Any feed back on the equipment used with company addresses will be highly appreciated. | Please identify if pos

Repair of FR4 double-sided pcb

Electronics Forum | Thu Aug 22 22:10:26 EDT 2002 | davef

Ooooow! �Can it be fixed?� Good question. How BAD did you damage it? * Since you are asking this question, I am NOT inspired by the potential that you have the skills to fix the board. Go Jeff Ferry�s site at Circuit Repair Center [If you can�t f

100nF 0805 ceramic cap with 25 Ohm resistance? Why?

Electronics Forum | Thu Jun 24 11:21:40 EDT 2010 | floydf

Hi, > > I have a 100nF 0805 ceramic cap (the most > common type!), Yageo brand (20+ pcs. on the > module). In our production run I get some errors > due to conductive caps (can be anything from 25 > Ohm to 5K - most are open of course). Only one

Re: Depanelization of PCBs

Electronics Forum | Tue Jul 14 07:12:53 EDT 1998 | smd

I asked the same question a couple of weeks ago. I received a lot of e-mail from salesmen et al trying to sell me equipment costing several thousand dollars. I was glad to get all the information I could, but there was no way I was going to get a PO

Cleaning Reworked BGA's.

Electronics Forum | Thu Aug 04 14:44:59 EDT 2005 | Shean Dalton

Hi Sandy B, You certainly can clean the BGA's using an inline or batch process. The correct method to hold them during this process, is the method that provides the desired outcome. I'm familiar with the desired outcome for cleaning singulated BGA

Die attach with solder paste

Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.

Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t

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