Electronics Forum | Wed May 30 17:59:24 EDT 2001 | jollyrodger
It may be the case (if you are using stencils to apply the epoxy) that you will have to indeed use a stepped stencil to appply the epoxy at a greater height. Not being an engineer i am not completely clear with the involvements of stencil design -
Electronics Forum | Wed Feb 19 13:38:09 EST 2014 | jsmorse
Are there any tricks to cleaning a stepped stencil while in use. There seems to always be paste left behind around the recesses of the stencil. We have tried many different wipe combinations and don't seem to be having much luck with it. The machi
Electronics Forum | Fri Feb 24 09:24:26 EST 2006 | russ
I agree with Jerry. We don't use 5 mil until we get to .4mm pitch.
Electronics Forum | Wed Aug 27 15:53:05 EDT 2014 | smtdoug
I always put the step on the squeegee side. You'll get some "shadowing" effect on any parts in close proximity to the stepped up region. It should be manageable with proper board / stencil design.
Electronics Forum | Thu Feb 23 18:05:53 EST 2006 | kennyg
What are some general guidelines for the minimum proximity of apertures to a stepdown on a stepped stencil. I have a step from 7 mils to 5 (one mil step each on the top and bottom). How far does the step need to extend beyond the apertures on the
Electronics Forum | Tue Jul 29 07:24:03 EDT 2014 | jandon
I think you need step on the bottom side of the stencil (undercutting) only to compensate elevations on the top side of the PCB, such as labels.
Electronics Forum | Fri Feb 24 09:20:44 EST 2006 | jdengler
Kenny, Why are you using a step? The components you list could be done with the 7 mil stencil. I would use 6 mil myself but I assume you may need the 7 mil for other components you do not list. Jerry
Electronics Forum | Wed Jan 26 07:40:15 EST 2000 | Dave F
Dennis: We stepped stencils on the board side to accomidate additive jumpers. They work fine. The steps are not close enough to affect fine pitch devices. Please describe how the stencil is sffected in the area of your FP devices. Dave F
Electronics Forum | Thu Oct 08 03:33:50 EDT 1998 | Thomas Blesinger
| | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remain
Electronics Forum | Thu Oct 08 22:20:44 EDT 1998 | Dave F
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
