Full Site - : thermo (Page 7 of 258)

Murray Percival Company Offering Deep Discounts on Pace Soldering Tips & Accessories

Industry News | 2019-04-15 18:42:38.0

Murray Percival Company today announced the launch of a spring sale on PACE items including but not limited to: Pace soldering tips in various sizes, desoldering tips, tip sets, the Pace TJ-85 ThermoJet Handpiece Kit, TT-65 ThermoTweez Handpiece with Tool Stand, and Pace Arm-Evac 50 Fume Extractor.

Murray Percival

PDR Rework Unveils ThermoActive Suite v.8 Revolutionary Rework Software

Industry News | 2023-11-20 15:40:11.0

PDR Rework is pleased to announce the release of its groundbreaking software, ThermoActive Suite v.8. This latest advancement represents a significant leap in the field of rework, offering unparalleled simplicity and efficiency.

PDR-America

Cimetrix 300 mm Tool Connectivity Software Continues Market Penetration

Industry News | 2002-05-14 09:21:49.0

Thermo Nicolet Ships FT-IR Metrology Tool Fitted with the Package

Cimetrix, Inc.

Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices

Technical Library | 2015-09-23 22:08:32.0

A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.

Flex (Flextronics International)

PACE SX-100 Sodr-X-Tractor Desoldering Handpiece (comes with MBT 301)

PACE SX-100 Sodr-X-Tractor Desoldering Handpiece (comes with MBT 301)

Videos

The SX-100 Sodr-X-Tractor is the solder extraction handpiece for high volume operations. It uses PACE's new SX-100 desoldering tips, the longest lasting desoldering tips availible on the market today. The SX-100 features a disposable collection chamb

PACE Worldwide

PACE SX-100 Sodr-X-Tractor Desoldering Handpiece (comes with ST-75)

PACE SX-100 Sodr-X-Tractor Desoldering Handpiece (comes with ST-75)

Videos

The SX-100 Sodr-X-Tractor is the solder extraction handpiece for high volume operations. It uses PACE's new SX-100 desoldering tips, the longest lasting desoldering tips availible on the market today. The SX-100 features a disposable collection chamb

PACE Worldwide

PDR Releases Barcode Scanning Software Integration

Industry News | 2019-02-26 18:21:21.0

PDR today announced the release of Barcode Scanning Software integration, the latest software innovation to complement its award-winning ThermoActive Suite Software. 3D code scanning is fully integrated into PDR’s ThermoActive Suite Software to enable high-volume rework clients with a time-saving feature to automatically call up the correct profile each time a code is introduced.

PDR-America

Effect Of Voids On Thermo-Mechanical Reliability of Solder Joints

Technical Library | 2019-10-16 23:18:15.0

Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.

Alpha Assembly Solutions

PDR Rework Systems to Present Breakthrough in Award-Winning Rework Software at APEX

Industry News | 2022-01-03 07:32:58.0

PDR today announced plans to exhibit during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The first in the industry to offer Auto Profiling Software, PDR now announces ThermoActive Suite 7.15.16 with Advanced PID Control Capability for ultra-precision auto-profiling and process control. The new ThermoActive Suite Auto Profiling Software will be launched in Booth #1617 for the first time.

PDR-America

See how PDR IR-C3 Chipmate really works!

See how PDR IR-C3 Chipmate really works!

Videos

This video is for the PDR IR-C3 Chipmate 2000 Rework system/station - Operational Video. It gives you an overview and shows you the basics of how to operate your PDR IR-C3 Rework system. www.pdr-rework.com

PDR-America


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