Electronics Forum: viewed (Page 6320 of 7895)

cp45fv-neo Emergency stop

Electronics Forum | Fri Aug 28 17:24:28 EDT 2020 | stephendo

Did you check all the voltages and fuses? The second worst is when a machine is down for a while and it ends up being something basic. The worst is when it started as something basic and someone introduces a new problem. Also could there be any opti

cp45fv-neo Emergency stop

Electronics Forum | Mon Aug 31 15:39:18 EDT 2020 | jmelson

Yes, the rightmost VME board is the IO_DPRAM, and it also handles the front panel buttons and E-stop inputs to the computer(s). So, reseat the connectors on the front of that board. Also, there may be an interface board on the bottom left (called C

Vapor degreasing cleaning

Electronics Forum | Mon Aug 31 16:30:01 EDT 2020 | emeto

I would question your motive "There's no way that I feel comfortable shipping boards after a selective without cleaning them, the amount of flux on the board is significantly more than from SMT". 1. Who said that residue should be cleaned and why? O

Vapor degreasing cleaning

Electronics Forum | Thu Sep 03 01:15:52 EDT 2020 | kylehunter

> The problem that we have seen applying NC flux > (EF2210) at selective solder is that the flux > overspray (relative to the nozzle path) did not > see high enough temperature to activate the flux > and turn it to a non-conductive

Vapor degreasing cleaning

Electronics Forum | Thu Sep 03 21:49:20 EDT 2020 | kylehunter

> Not in our case, the pre-heat temp was not high > enough. Also our pre-heat is only from top > (KISS104). Ahh that makes total sense. We have bottom IR, and have thermocoupled at 100c, so I think we should be good on that end. Anoth

X-Ray Gage Study Question

Electronics Forum | Mon Aug 31 14:45:37 EDT 2020 | SMTA-64387994

Can anyone provide any insight to an appropriate way to apply a Gage R&R study to an x-ray inspection machine? We have a Vitrox V810 S2EX machine that we would like to perform a measurement system analysis on. What methods do you use? Which type of G

GSM FlexJet z-safe sensor

Electronics Forum | Mon Aug 31 19:15:36 EDT 2020 | dilogic

We have GSM2 with FlexJet heads (an older one). There are 7 sensor amplifiers (with LED indicators) for touchdown detection and one for z-safe detection which is of a different type (with numeric LED indicator). I can't find anywhere what the right n

TOMBSTONE defect Redution suggestion.

Electronics Forum | Sun Sep 06 03:24:31 EDT 2020 | rsatmech

Hi All, We are frequently getting tombstone in an induction component. (0102) There is no paste offset or placement offset. PCB pad design is not as per recommendation. Stencil opening is 1:1 Same part used in two locations and both the locati

TOMBSTONE defect Redution suggestion.

Electronics Forum | Tue Sep 08 15:12:56 EDT 2020 | cyber_wolf

I concur with Spoilt on all accounts. If the tombstones are isolated to the same P/N this is an indicator that your process is probably not to blame. At this point you have to try and mitigate the issue. Things to try [if possible] : 1. Try a soa

TOMBSTONE defect Redution suggestion.

Electronics Forum | Fri Sep 11 15:58:50 EDT 2020 | majdi4

You haven't communicated what thickness of stencil you are working with ... it's interesting to know..at first, you need to reduce the amount of CAB deposited because with 1X1 stencil aperture size you are depositing an amount important CAB .. so, I


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