Electronics Forum | Wed Feb 21 09:55:45 EST 2001 | ramigary
Hi! We are a low production contract manufacturer company, We have few stencils and low productions, but we have a lot of problems with misprintered pcbs, my question is �is there some machine to clean only pcbs?� Excuse my english.. Ram�n I
Electronics Forum | Wed Feb 28 19:44:50 EST 2001 | pzohbon
I am having problems with voids in our soldering process. I believe it to be the fact that we use a no clean flux without control on how the boards are handled (gloves, procedures, etc.) Does anyone have suggestions on the appropriate place to start?
Electronics Forum | Thu Mar 01 10:29:00 EST 2001 | davef
If the soldering process is not controlled, the results are variable, regardless of the flux type. Tell us more about your concerns, process, solder, etc
Electronics Forum | Fri Mar 16 13:33:21 EST 2001 | gdstanton
Anyone out there have a real good stencil printing process control document for an MPM Corporation stencil printer model # SPM? We are seeing lots of bridging, wetting, and filling problems. Thanks in advance for your help.
Electronics Forum | Mon Apr 16 21:21:12 EDT 2001 | davef
Two off the top of my head are: 1 Fluxing / soldering process is either not in-control or not capable. 2 Ionic materials on the board board or components compromise the LT reliability of the product.
Electronics Forum | Tue Apr 17 10:29:07 EDT 2001 | tg0929
I would like to hear from anyone who has had experience using Alpha NR310 no-clean flux in their wavesolder operation. We are having difficulties controlling residue levels on boards. Thanks.
Electronics Forum | Mon Apr 23 20:33:37 EDT 2001 | davef
I agree that solderability is THE issue, but we choose not to get into that pissin' contest. [We don't like the selected test method, either.] We believe that our coating thickness spec provides: * Solderability level that we seek. * Repeatable tes
Electronics Forum | Mon Sep 18 17:55:55 EDT 2000 | Dave F
Reworking BGA with hot air systems (ie, AirVac, SRT) is fairly complicated and requires fairly rigorous process control. Please compare and contrast BGA rework using hot air and your laser based system.
Electronics Forum | Fri May 25 18:05:33 EDT 2001 | davef
We don't measure the viscosity of paste or epoxy as a proces control method. Look here http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=1559&mc=12
Electronics Forum | Mon Jun 18 11:06:31 EDT 2001 | Gil Zweig
In-line systems are effective in detecting the obvious defects such as solder bridges, missing balls and excessive solder voids. They may not be as effective in detecting the subtle changes in solder bond shapes (signatures) indicating loss or chang
