Electronics Forum | Tue Feb 16 12:14:12 EST 1999 | Gregg Reick
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Thu Dec 03 13:39:52 EST 1998 | Russ M
| | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure
Electronics Forum | Thu Apr 16 23:59:45 EDT 1998 | Mike C
| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu
Electronics Forum | Tue Aug 28 13:46:46 EDT 2001 | mparker
To clarify on "Opportunities"- With 1000 components, the opportunities are far greater than 1000. You have 1 opportunity per component for a component defect i.e. bent lead, damaged part, tested bad, etc. You have a second opportunity per component
Electronics Forum | Wed Apr 10 08:39:11 EDT 2002 | Alan W.
Here are some of the problems (and my pet peeves) that can be found during a machine set-up. I have run into each of these many times over the years. Wrong part value: This can usually be traced to a purchasing, incoming inspection, or kitting mist
Electronics Forum | Thu Apr 11 18:47:43 EDT 2002 | slthomas
A couple of questions to establish a baseline for when the check writers start asking questions........ How many of you have vision systems on site for BGA inspection? If you don't have it, do you do 100% X-ray, or did you just nail down the proces
Electronics Forum | Mon Oct 14 17:59:45 EDT 2002 | russ
When I used the micro-stencils, We purchased the holder from the stencil manufacturer. As far as design we used 5mil stencils for uBGAs,6-7 mil for larger 63/37 balls, and 8 mil for CBGAs. Aperture openings used were slightly smaller than what we wo
Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Wed Jun 18 10:07:02 EDT 2003 | caldon
There are a few directions to go from Here... 1) Outsource it to a CM, 2) Capital investment both have there issues. To Out source I would have processes in place to Inspect quality, resolve issues, Assure quaility, and Hope they can meet your deadli
Electronics Forum | Mon Jul 21 20:42:12 EDT 2003 | iman
Don, thanks for the thoughtful insight, can I run some thinking points for your further assistance? 1) ours is a Au over Ni PCB bareboard. Do you think excessive Au thickness is any way a influence for poor solder formation? I did notice the PCB ba
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