Electronics Forum | Wed Mar 17 19:41:15 EST 2004 | Dreamsniper
I'm hit with the above problem and found out that the BGA's themselves have fibres on their solder balls. I have soldered some without having the knowledge of the above fibres and found that the fibres are caught between the PCB pad and the BGA solde
Electronics Forum | Mon Apr 12 11:43:11 EDT 2004 | wgaffubar
Your wash unit should dry the boards well enough for you just take them and run them second pass within minutes of exiting the wash unit. We did it for years with no problem at all. If you must the hour at 125 will dry the wash water more than enough
Electronics Forum | Thu Jul 28 03:38:39 EDT 2005 | Rob
Basically they are tiny EEproms powered by an induction loop. The EEproms or "Tags" store a unique identifier on them and can be read (or written too) by the small RF field generated by an induction loop reader from upto around a couple of feet aw
Electronics Forum | Tue Apr 13 14:14:59 EDT 2004 | russ
I have actually printed this same condition with type 3 paste Alpha WS709. I posted this for discussion and cannot remember what I called it. We did need to clean the stencil after every three prints. I did not check volume on these locations but
Electronics Forum | Wed Apr 28 09:43:22 EDT 2004 | Rob
When it comes to double-sided boards, how does one support a board so that those supports don't hit any components on the side already run but yet keep the board firm and rigid? Is it more of an engineering design to layout the board in such a way th
Electronics Forum | Mon Jun 14 21:02:50 EDT 2004 | hap
it is not practical to target an exactly 1 mil film thickness, the materials manufacturers do not give an exact solid content figure but only a target range. temperature and batch preparation also play a small role. You could probably target 1 mil p
Electronics Forum | Tue Aug 10 06:45:54 EDT 2004 | Snehal Acharya
Hi to all, I'm facing a soldering problem with one of my series of Product, since we were using a two different kind of PCB 1.GE(Glass Epoxy)2.PP(paper phenoline) in later PCB if i will use the same profile of the GE then it will get backed more & i
Electronics Forum | Tue Aug 17 10:37:45 EDT 2004 | M.Enright
Some cracks are really obvious,straight down the middle of the capacitor.Some are slight hair line fractures which fail at ICT.In all cases seen,all cracks are through the centre of the cap.My worry is that there may be some which have fractures and
Electronics Forum | Mon Aug 23 14:49:36 EDT 2004 | msjohnston1
I have no experience working with the systems you listed about, however I have experience working with a GSI Lumonics SVS systems measuring solder paste. I am also in the process in looking for new equipment to replace the GSI systems that is capabl
Electronics Forum | Wed Sep 29 06:20:14 EDT 2004 | Peppe
FengAng, I'm involved in similar activities on telecom products and we use as reference: MIL-STD-883E, JESD22, IEC-749. We have 2 climatic chamber to arrange a wide range of test, depending on customer use and/or specs. Based on that experience, we p
