Electronics Forum | Tue Jul 12 22:15:50 EDT 2005 | Chris Ong
Hi, My stencil maker also say the same thing on 1:1 for lead free. I am using electro-form stencil. You can look for Mr Richard or Mr Chong at wkchong@dek.com. Hope this info will be useful for you
Electronics Forum | Thu Jul 14 04:11:16 EDT 2005 | zsver
What is written on the display at error type and error address. from error address you can find out where the error comes from.
Electronics Forum | Thu Jul 14 12:11:58 EDT 2005 | geb
The vacuum will pull the stencil towards it if there isn't a frame because the front and back of the stencil aren't being supported by anything. Can't you use a frame, they're only about �20.
Electronics Forum | Mon Jul 18 02:47:27 EDT 2005 | grantp
Hi, It sounds like your a little new at profiling, and can be difficult to do well. We purchased a KIC profiler that has software that will take your profile data and tell you the best oven temperature settings and conveyer speed to use. You need
Electronics Forum | Thu Jul 14 10:00:21 EDT 2005 | chunks
Any one using SPC to monitor their wave solder process? My point is collecting defects and using a scatter plot is useful but only after a problem occurs. SPC's true function is to warn of impending problems that are about to occur. Can SPC really
Electronics Forum | Thu Jul 14 16:38:13 EDT 2005 | sleech
Our present lab went "South." We need a lab that can do temperature/humidity conditioing, convection oven baking, C-Mode Scanning Acoustical Microscopic package inspection and "No-Pb" reflow simulation. We are evaluating a low temperature package dry
Electronics Forum | Sun Aug 21 15:54:15 EDT 2005 | Ken
not to be anoying....but a topaz can be configured with a 54mm camera an when using the 20 micron head 1 spline. It will place accuratly to +/-0.02mm Imagine 1 machine that works from 0402 to 54mm square! Now that's flexible.
Electronics Forum | Tue Jul 26 04:34:59 EDT 2005 | aj
Guys, I have very little experience in quoting for new jobs on an automated assembly line . Can anyone give me some pointers? I know this is a broad subject and depends on overheads etc. but any assistance would be appreciated aj
Electronics Forum | Thu Jul 28 08:35:58 EDT 2005 | jdengler
Most likely a feeder that has a rough advance. This can cause the part to flip in the tape before the nozzle gets it. Jerry
Electronics Forum | Fri Jul 29 19:21:59 EDT 2005 | Jason Fullerton
Definitely feeder related - we get it all the time on those package parts. If you can, slow the tact of the feeder advance a bit (if it's on T&R). We also don't catch it at placement, but at pre-reflow visual or AOI.