Electronics Forum | Fri Feb 06 13:19:25 EST 2009 | markhoch
Hi Philip, If Brian doesn't mind, I'll take a stab at this one. Those types of questions are best directed to the Manufacturers themselves. Here are the websites for the three Pallet Manufacturers that Brian recommended. (I've also included a fourt
Electronics Forum | Wed Apr 22 22:51:42 EDT 2009 | rkevin
I was using Indium 8.9 HF and AIM 257-2 was far superior in reducing voids. Just wait till you have a problem, if you have less than 10 lines running 24/7 don't expect a call back from Indium's Tech Support. It's been a couple weeks since we swithed
Electronics Forum | Tue Jun 02 22:19:17 EDT 2009 | mikehe
We have been doing BGA's for years now, and I would suggest updating your profile and place a thermal couple on the BGA, keep in mind the bigger the part the more heat it will need, We stencil print all of BGA's from simple bga's to complex ones, you
Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289
This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i
Electronics Forum | Thu Jun 25 22:00:54 EDT 2009 | hayee
Hi, I want to make a small setup for manufacturing PCB's based on SMD's for (pototyping boards, etc). I don't know clearly what are the equipments required for this purpose. I have an idea that we have to use (Pick n place station, Screen printing
Electronics Forum | Thu Nov 12 04:35:13 EST 2009 | sachu_70
You can certainly venture out to the nearest lab for in-depth analyses. But since you mention 2-3% defectives in a batch, there is much you can do in-house as well. Measure the height of your solder paste deposit (in zero print gap condition)across a
Electronics Forum | Mon Apr 26 09:54:59 EDT 2010 | baildl632
What type of wave machine? Does your machine have a pump speed dial? Does your machine have the ability to raise and lower the pot? Raise pot to as close as possible to the pallets/boards and make sure they can pass over the nozzle without hanging o
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Mon Aug 30 14:14:23 EDT 2010 | sreid
Thanks Dave, I was able to get an automated dispenser to apply an amount of paste that should be sufficent. My only question is should I bake the boards before solder is applied and the boards are reflowed. I ask this because the boards have been s
Electronics Forum | Thu Sep 16 01:54:46 EDT 2010 | sachu_70
Hi Gani, Immersion Ag finish has lesser shelf life as it can get more easily oxidized on exposure. However, I see concern in your Reflow profile. A few questions: Have you compared your reflow profile to the solder paste manufacturer's recommended pr
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