Electronics Forum: electronics (Page 6711 of 7898)

BTU profile

Electronics Forum | Tue Aug 13 13:46:54 EDT 2002 | soupatech

Hello again.... I have been reading up on profiles and how to set them up for different results. I now have an upcomming job with some strict guidlines on reflow. I was wondering... if I were to email a pic of my desired profile could someone out the

Vent Residue Cleaning

Electronics Forum | Fri Aug 16 11:03:22 EDT 2002 | Claude_Couture

I use Kyzen's Aquanox SSA cleaner in a heated parts cleaning tub to clean anything with flux condensate on it. When heated to 120F, the stuff melts away like ice under hot water. When the cleaning solution is loaded, I send it in an evaporator. The s

Coin Cell Battery

Electronics Forum | Wed Aug 14 21:13:30 EDT 2002 | davef

Insulating tab approach, like: * Go to page 5 of http://www.kalatel.com/lit-rack/install-man/kts_253_253-16_man.pdf * http://support.tandy.com/support_radios/doc64/64039.htm * Go to �Fixing�, Step 6 of http://www.sunvic.co.uk/TLX%20Digital%20Room%2

Refreshing PCB Solderability

Electronics Forum | Wed Aug 14 16:44:54 EDT 2002 | dragonslayr

What is the surface finish? HASL, Entek? what? If HASL, ask your fab supplier for recommendations, maybe even rerun the boards through the HASL process. The fab house would have to strip off the old coating and reapply. Just a thought, depends on y

Baked Components

Electronics Forum | Thu Aug 15 22:35:54 EDT 2002 | Brandon

I've done some experiments on baking parts as we got pop corning QFP's on our production line. This QFP has moisture level of 5 and I baked them @ 125'C for minimum of 12 hrs. So far results were great but I have a question: Forum says that I cannot

component baking

Electronics Forum | Fri Aug 16 11:13:17 EDT 2002 | kenbliss

I have a question for everyone about component baking. In my view this is rework. The component was manufactured and shipped correctly and should not need baking in order to use it. Some how in storing the component in a stockroom atmosphere (I as

component baking

Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss

Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the

component baking

Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette

I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com

component baking

Electronics Forum | Thu Sep 12 11:50:58 EDT 2002 | stepheno

http://www.jedec.org/download/search/jstd020b.pdf http://www.jedec.org/download/search/jstd033a.pdf The above links are for JEDEC standards regarding moisture sensitivity. SMT magazine has an article a few months ago regarding a company that saved

Integration of manual odd form / low volume pick and place

Electronics Forum | Mon Aug 19 11:13:18 EDT 2002 | ksfacinelli

I would like to understand what different options people are using to place low volume / odd form parts. I am very familiar with the tweezers / vacuum pen method however this can be less than desirable. I am looking into a manual pick and place to


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