Electronics Forum | Wed Apr 21 13:21:33 EDT 1999 | Scotty
Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The process
Electronics Forum | Tue Apr 13 19:14:25 EDT 2004 | Dreamsniper
Hi DaveF, To explain. The BGA that we have is from Motorola. The solder balls of these BGA's are Eutectic Solder and processed using a NC flux (as per info from supplier). So this means that the BGA pad and solder connections had NC flux process. W
Electronics Forum | Wed Apr 21 15:27:24 EDT 1999 | Murray Pulman
Hi Scotty sorry to stir things up but we assemble some seriously high value boards on a contract basis with vias through bga pads. However, not blind vias, so there are no cleaning issues & we use 6 though stencils to provide a little extra paste t
Electronics Forum | Wed Jun 03 17:40:52 EDT 1998 | Dave F
What methods do people use to dress pads after removing and before replacing the BGA? We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? Dave F
Electronics Forum | Mon Aug 11 13:55:09 EDT 2008 | guhansub1
Your defect may be possibly due to black pads, although it is rare on component side. Is your BGA pad finish ENIG? If so, inspection using a SEM can give clues on the presence of black pads
Electronics Forum | Fri Oct 31 14:09:07 EDT 2014 | wbrenner
Having a problem with a DEK printer. In the back to front motion, getting poor ramdom paste volume on micro BGA pads. Other BGA 1 mm pads are fine. The front to back motion is fine. Any throufghts on this directional issue. Ran ~200 panels no pr
Electronics Forum | Fri Jul 31 19:14:58 EDT 2020 | emeto
Interesting one. I your machine placement algorithm capable to catch missing ball on the BGA while placing? Second question will be about component itself - datasheet will probably help. BGA body amterial? BGA balls alloy? BGA pad material before bal
Electronics Forum | Tue Mar 24 13:21:16 EST 1998 | Earl Moon
| Should I use thermals or direct connects on | vias from BGA pads to power planes. The via is | connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capab
Electronics Forum | Wed Mar 10 21:55:57 EST 2004 | Dreamsniper
Has anybody here could provide me good infos regarding BGA rework Kits other than the Flextac Stencil. Also on what sort of fixtures and toolings they provide to help me align the rework stencil onto the BGA pads. Thanks in advance... Hi to Dave F.
Electronics Forum | Tue Jul 07 19:52:09 EDT 1998 | Gary Miller
after you have removed the solder from the pads you can reapply solder psate onto the pads using a single site stencil printer from Mini Micro Stencil.
