Electronics Forum | Fri Aug 15 01:31:17 EDT 2003 | Jay
Hi All, I work for a contract manufacturing and we are having a new PCB to build. The PCB has OSP coating on it and it has been sitting open in the production floor for about 15 days. I am not sure weather it will affect the soldering process or not
Electronics Forum | Tue Sep 09 15:22:39 EDT 2003 | gdstanton
Anyone have any experience with immersion white tin over copper plating? We are seeing opens develop under BGAs after we bake and conformal coat. And when we lift the parts the pads are 60% of the original size. Need some advice on possible causes
Electronics Forum | Wed Nov 05 13:43:52 EST 2003 | swagner
I just did a bga job with square aperture's, the reasoning is for enhanced print release and additional paste volume. Be careful of the edge to edge clearance between the stencil openings, I don't recommend going below a 8 mil clearance, you could b
Electronics Forum | Thu Nov 27 21:25:15 EST 2003 | Al Capone
Has anyone in this forum experience the can soldering defect? The can component is supposed to be placed on top of a group of RF components to protect the frequency from escaping and interfere with the adjacent RF component. After the reflow process,
Electronics Forum | Fri Dec 26 13:35:14 EST 2003 | fpcb
hi, When I start a MPA-80 ( NM 2529T ) I have a 4600 error, ( 1 block stop ) , I check the covers and the pressure : all ok. I monitor the head I/O address 012 and the relative bit 6 is responding when I open the covers. All seem ok BUT the error
Electronics Forum | Wed Jan 21 06:49:44 EST 2004 | mk
During a discussion about smt design one of our attendees said that he had been taught that stencil openings were typically designed .005 below the size of the copper smt pads. My experiance has been stencils are usually designed 1 to 1 with the copp
Electronics Forum | Wed Jan 21 10:41:57 EST 2004 | davef
Depending on how you frame the question, either of you could be correct. Neither of you mentioned stencil thickness, which together with aperture opening [and stencil fabrication technology] define how well a paste will release. So, the key measure
Electronics Forum | Wed Mar 10 11:19:59 EST 2004 | mrmaint
Paul, I have seen harness issues in the past that have given some unusual results. The problem we found was that depending on the rotation and position of the cut/clinch unit the opens/shorts were not consistent. The first place i would look is at th
Electronics Forum | Tue Apr 13 08:25:15 EDT 2004 | arcandspark
I would have gone to a .004" stencil but again, the board designers, which we have no control over or are we allowed to give input to, have made the pads on all connectors and many other parts so small that we are almost seeing insuffecient solder us
Electronics Forum | Mon May 03 16:29:17 EDT 2004 | Craig Miller
Its a good machine. I think it is the best thing out there for the money. You will get false fails with any machine. You should not get false accepts unless you open the tolerances to far. Once you get used to it you can generate a program in few hou
