Electronics Forum | Fri Nov 16 08:33:46 EST 2007 | rgduval
For RoHS assemblies, we're spec'ing at least FR-406 for the higher Tg. We're currently requesting our customers to use ENIG finish, as we've had better luck with assembly in our process; but we're currently experimenting wtih lead-free HASL. As far
Electronics Forum | Mon Nov 19 09:34:50 EST 2007 | bbarton
Real Chunks...Yes, that's the most glaringly obvious defect in the short term (you'll probably find it on your production floor if it's really bad) but you may find that everything looks good short term only to have a high level of customer returns..
Electronics Forum | Mon Nov 19 19:14:07 EST 2007 | jmelson
I've been running 90% lead-free (still have a couple components I can't get reliably in RoHS compliance) with a peak temp of about 238 C, on standard FR-4 boards. The only real problem is the pad adherence is compromised, making rework of the boards
Electronics Forum | Tue Nov 20 23:04:10 EST 2007 | wim
I am currently looking at selective solder > machines. The two that i have looked at are the > KIss 104 and the APS Novastar SP A400. Both > machines are in the price range i need to be in. > There are very different from each other as far > as
Electronics Forum | Tue Nov 27 19:41:53 EST 2007 | g2garyg2
Well, there seems to be many opinions, many of which could be correct, however... With the proper laser they can be quite good for soldering. Here are a few guidelines I would like to suggest. 1) Have your product soldered first (by the vendor) 2) T
Electronics Forum | Tue Nov 20 20:26:54 EST 2007 | davef
Peter: The above link to the the picture of the assembly is broken. Comments are: * Yes, RTV is completely useless for applications like you describe. Epoxy is a much better choice. * Dave G, in an archived thread on SMTnet, talks about using 3M Jet
Electronics Forum | Wed Nov 21 09:19:09 EST 2007 | Paul M.
Need some opinions from you fine folks. We are building assemblies 90% SMT, 10% TH. Fine pitch and BGA devices, etc. The customer is complaining about cold solder joints (SMT) after about 1 year of use, scattered thru-out the assembly, not consistan
Electronics Forum | Fri Nov 30 00:51:10 EST 2007 | vinitverma
Here are the differences (Eclipse vs Eclipse II) Optimum Speed: 5000 vs 6500cph Feeder Positions (8mm) : 80 vs 94 PCB Loading Time : 4s vs 5.3s PCB Thickness : 0.6-3mm vs 0.5-4mm Max Component Size : 32mm vs 45mm (optional camera possible on Eclipse
Electronics Forum | Tue Nov 27 08:13:04 EST 2007 | davef
C1: is there any gap between the pad and terminal if we place the glue? R1: Yes, there is a gap, but it is easily bridged by the amount of solder in the wave. C2: Btw, my practice to print solder pate then punch glue then PNP component and finally
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
