Electronics Forum | Sat Nov 24 15:44:28 EST 2007 | mika
Hi DaveF, I had a short look into the Nr1. IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Most interesting reading, but one thing though, I could not find any information about the oven profile. Just a picture of it. My question is of about the
Electronics Forum | Wed Nov 07 12:58:20 EST 2007 | Frank
I agree with Jon, that using Gerber data is a pain in the butt, but that doesn't answer your question about what software to use. CircuitCAM, VALOR, UniCAM (now Tecnomatix), and GC Place are the more popular third party software packages that deal d
Electronics Forum | Wed Nov 07 12:29:41 EST 2007 | oswaldorey
Although greatly publicized and many papers on the subject, I wish to hear experiences from the field from professionals who have migrated from SnPb wave soldering to PbFree wave soldering. I am being pushed by one of my largest clients, an internati
Electronics Forum | Fri Nov 09 08:57:56 EST 2007 | bbarton
By and large, the industry has determined that SAC alloys are the "best fit" for replacement of SnPb in our industry. SAC305 seems to be the default alloy at this time. There are several other alloys out there, each with their own strengths and weakn
Electronics Forum | Tue Nov 13 14:11:26 EST 2007 | ratsalad
We use SAC305 for solder paste, and we have been pretty happy with it. When we jumped in to this Pb-free business I was a little nervous due to all the horror stories you hear about the process changes. It's not that big of a deal (at SMT). Over
Electronics Forum | Wed Nov 07 17:57:01 EST 2007 | jmelson
OH! He he, St. Louis! I have recently acquired a very good P&P machine, and am in the St. Louis area. I got the machine primarily for my own manufacturing, but there is plenty of time available on the machine. If you'd like to see how the process
Electronics Forum | Thu Nov 08 05:55:38 EST 2007 | jola
Hi. We have a medium to high volyme production with a lot of different boards to run inour lines. We do some prototypes as well but not as our main production. We have a lot of change over time that we try to reduce and as far as it's not double side
Electronics Forum | Sat Nov 10 21:15:04 EST 2007 | mika
make 4 square rounded corner apertures around the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. We SMT-mount & reflow soldering various QFN packages onto our customers pcb:s wi
Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj
BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >
Electronics Forum | Mon Nov 19 18:58:28 EST 2007 | jmelson
On big chips, we use a tape printing device, I think it is a Brother PT1750. We have a small device, though, that is in an SO8 package, and the only thing we've come up with is to scratch a product letter code and the program date with a stylus. Th
