Electronics Forum | Wed Feb 12 20:13:39 EST 2003 | cmiller
Does anyone have any experience with setting up a nitrogen supply system to a wave solder machine that is equiped for it? Does the nitrogen need to be room temp or higher? Does it make a big difference with bridging or solder quality? We bought a use
Electronics Forum | Fri Feb 21 10:31:48 EST 2003 | adlsmt
We dont have the debridging knife. I had one on an old Hollis machine I had once. It was totally worthless. I am setting up the nitrogen today. I will let you know how its goes. We are using a water based no-clean. The nitrogen will probably make a
Electronics Forum | Wed Feb 12 21:14:08 EST 2003 | davef
We allow people in our shop to take calls on their cell phones any time they get a call, thinking that in case of an emergency they should be able to respond to their family's need for help. We ask that people close their calls that do not require i
Electronics Forum | Thu Feb 13 08:24:13 EST 2003 | MA/NY DDave
Hi Since you had such a funny funny title I thought I would tell you a funny to make you giggle hopefully. My middle initial is F. So I am also David F Gee funny writing to yourself YiEng, DDave
Electronics Forum | Wed Feb 19 20:52:49 EST 2003 | davef
Consider that: * Something may be wrong with your glue. [That you have globs of flat glue on your board seems to indicate that your glue is probably cured properly. How easy is it to "pop" components from the board?] * Someone has put a goopy crud o
Electronics Forum | Fri Feb 21 19:54:16 EST 2003 | jersbo
Make sure your epoxy dispenser is repeatable. DO an experiment , inspect every board to verify epoxy is there before the part is placed... Is there an epoxy residue left on the PCB where the parts fall off after wave??? We do the epoxy paste proce
Electronics Forum | Tue Feb 25 15:29:46 EST 2003 | MA/NY DDave
Hi Locktite is telling you to cure first, maybe for a good reason. So the epoxy becomes stable just before solder reflow moves stuff around and around and then settles. A WEG yet if you did some cross sections and analysis you might find piles of
Electronics Forum | Tue Feb 25 23:17:12 EST 2003 | MA/NY DDave
Hi Up above in his operation / process description after a call to Locktite and then my note and then your note, we may have found the problem. One never knows at a distance. It appears he is striving to do soldering/reflow first and then concurren
Electronics Forum | Wed Feb 19 21:20:17 EST 2003 | davef
Consider: * http://www.ecd.com/Seminars/bobwillis.asp * http://www.assemblyonline.com/ Intro%20to%20Surface%20Mount%20Technology%20T&CF.doc * http://www.smta.org/ * http://www.rayprasad.com/training.html * http://www.omnitraining.com * http://ww
Electronics Forum | Thu Feb 20 17:18:24 EST 2003 | davef
Give us infortmation, please. What is [are]: * Height board to board side of the interposer on the low side of uBGA * Height board to board side of the interposer on the high side of uBGA * Alloy of solder balls, no paste was used correct? * Type of
