Electronics Forum: thread (Page 7047 of 7890)

Soldermask - sulfur presence

Electronics Forum | Mon Jun 25 03:52:24 EDT 2012 | awtm

Our Customer had detected tarnished pad on ImAg PCBA and had conducted several SEM-EDX test at the soldermask below some of the chip resistors. High concentration of sulfur was found and it can be significantly reduced after further chemical cleaned

Soldermask - sulfur presence

Electronics Forum | Mon Jun 25 11:33:20 EDT 2012 | davef

The immersion silver is an active surface and readily combines with sulfur from the environment. Silver sulfide tarnishes the surface and creates doubt about the integrity of the finish at inspection. [uyemura.com/library-4.htm] Your customer's boar

Blow Holes voids in solder fillet on caps

Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef

Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as

IR Rework Machine

Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2

Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa

QFN aligment issues

Electronics Forum | Fri Jun 29 10:56:56 EDT 2012 | jorge_quijano

Hi guys, I need your advise on this, I have a very uncommon PCB design (at least for me, I've never seen anything like this...) it is 32" x 18" x 0.062" and has 9 QFNs that are driving me crazy, I'm not able to get a good alignment, I can get a mediu

question about reflow- it it ever a long term solution?

Electronics Forum | Tue Jul 03 16:15:08 EDT 2012 | kq702

Hi, when they did the reflow with the south bridge chipset they took a heat gun and went arround the chip in circles. This is what I did with the broken apple motherboard. I covered the board in tinfoil and cut out the squares arround the gpu, cpu an

baking out pcbs after reflow process

Electronics Forum | Thu Jul 05 11:26:08 EDT 2012 | cobham1

I need help with how long do I need to bake out double sided PCB's that have been cleaned. The units will not be reworked but instead will be moved on to hand stuffing. I have looked in IPC CH-65B and J-STD-033C. I get information for parts if I am r

baking out pcbs after reflow process

Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon

You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com

Phillips Topaz LED intensity

Electronics Forum | Thu Jul 05 20:54:27 EDT 2012 | actioncontrols

Hello: We have used our Phillips Topaz on a number of volume jobs and been very pleased. A while ago it became apparent that the vision LED's were growing dimmer as evidenced by having to adjust light intensities upward for various components in so

5% color spot in HIC

Electronics Forum | Mon Jul 23 08:35:33 EDT 2012 | grahamcooper22

The lower the RH in the MBB the better for all moisture sensitive devices. Maintaining less then 5% will mean no parts of between 2a-5a MSL will need drying before use. The calculation uses 10% because it is a sensible amount of desiccant to use base


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