Electronics Forum | Fri May 02 12:54:55 EDT 2003 | Chris Lampron
Hi LWEI, This is not a permanent fix for the problem. We have had similar experiences with double sided boards. As a fix, we have applied water soluble solder mask to the edges of the component. This holds the component adequately for second side pr
Electronics Forum | Tue Nov 04 16:32:22 EST 2003 | Marc
Marc, I agree with Dennis. Your best method is to apply solder mask over the pads, then install the BGA. You can also remove the balls or completely remove the pads, but it take a skill person to do it. We do all that type precise rework in Southern
Electronics Forum | Mon Mar 29 07:21:51 EST 2004 | jdumont
We are also having the same problem here. I was told earlier that it could be a problem with the solder mask during the raw board manufacturing level but then I noticed that the problem was only surfacing on boards that went through the wave. As far
Electronics Forum | Tue Apr 06 11:17:01 EDT 2004 | ccl
hi, i encounter gold surface contam issue on wire bonding ring after prebake at 150 C for 3 hrs, tis cause wire bonding non stick issue. the contam seem begin at the solder mask area toward center of the bonding ring, but is not consistance.
Electronics Forum | Thu Jun 17 06:39:41 EDT 2004 | davef
Q1: Why are most common PCB's green? A1: Tradition Q2: What are the tradeoffs, ie electrical characteristics, etc for changing board colors? Q2: None. We use different colored solder mask on boards to indicate different development stages. See you
Electronics Forum | Thu Sep 30 17:36:17 EDT 2004 | GIO
i have a 0.5 pitch(19x19 pbga array) ..with a pad of 20 mils (thou) , solder mask is same...(20th..)..and an stenCil aperture of rectangular 22 X 22.1 thou...WHICH SHOWS..I AM HAVING AN OVERPRINT..MY PASTE IS A NO-CLEAN.. COMMENTS PLS...
Electronics Forum | Mon Mar 07 06:31:02 EST 2005 | pjc
The Camalot Gemini II is capable of dots for 0402 chip. What would an Electrovert person know about that? With a 32gauge needle you can put down as small as 0.006" dia dot. For information about dots for 0402 chips, please contact Camalot application
Electronics Forum | Fri Dec 09 08:11:56 EST 2005 | rlackey
I'll rephrase that - you've got rather a lot forward! Thanks on the zipper - wasn't sure if there was another trick to learn there. We used to use it on crap free issue boards with no solder mask between the pads, and on ultra fine pitch before we
Electronics Forum | Thu Dec 07 20:28:07 EST 2006 | davef
When rushing to get a job done, it's easy to accidently remove solder mask from a nearby via when dressing BGA pads after removing the part. Just hit the via with some super glue [then say a small prayer] and push on. As an alternative, look here:
Electronics Forum | Mon Dec 18 23:24:50 EST 2006 | grantp
Hi, Yes, I would hate to resort to cleaning, but the product must be clean. We have been using palettes to keep most of the flux off the PCB, but there is still residue around the connectors. Does anyone suggest a good no clean flux to use with le
