Electronics Forum | Wed Jun 13 16:13:54 EDT 2001 | Igmar
Have anyone seen this problem: Capacitors (100nF 0805) placed on PCB and then appear cracked after reflow. After reflow, the solder joints look visualy acceptable. Then capacitors fail during testing. When attempting to remove capacitor with hot sol
Electronics Forum | Thu Jun 21 22:35:11 EDT 2001 | me
Yes, Pb Free is coming soon... I am studying both Sn/Pb and Pb Free solders. Obviously the profiles will be much different for both pastes. Not to mention that one of my 0201 resistor vendors is switchng to Pb Free terminations in the near future!
Electronics Forum | Fri Jun 29 14:13:05 EDT 2001 | markhoch
Just a quick thought on solder balls "or beads" caused when using NC paste. I found a spec (12.4.10 in IPC-A-610C) that says solder beads are acceptable if they are entrapped in NC flux residue and can not be dislodged in the normal service environme
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
Electronics Forum | Tue Jul 03 22:18:33 EDT 2001 | davef
Assuming that you are talking about voids in solder connections: * Consider voids on the surface of your solder connection a defect. * Consider voids that you can't see to be a process indicator. See A-610C, 12.4.8 for authoritative guidance.
Electronics Forum | Thu Jul 19 08:04:04 EDT 2001 | dahsr
I have a sealed and refridgerated 350g jar of solder paste (water soluable flux). According to the label it expired July 1st. 2001 after the 6 month shelf life. Can this be used? Why or why not? What is the relevance of the expiration date? Can I re-
Electronics Forum | Tue Jul 24 08:22:16 EDT 2001 | markhoch
We're getting geared up to start placing 0402 comps. for the first time. I'm trying to "touch all my bases" before we actually go live. I've verified our placement machine capabilities and investigated my solder paste performance in regards to 0402'
Electronics Forum | Tue Jul 24 08:22:56 EDT 2001 | markhoch
We're getting geared up to start placing 0402 comps. for the first time. I'm trying to "touch all my bases" before we actually go live. I've verified our placement machine capabilities and investigated my solder paste performance in regards to 0402'
Electronics Forum | Tue Jul 24 13:15:22 EDT 2001 | Steve Schrader
Greg, The increased space and hence potentially increased airflow will have no effect on "solderability." It may effect the temperature that the balls see and that is a different issue that can be worked from a profile standpoint if you are not hit
Electronics Forum | Sat Jul 28 05:31:20 EDT 2001 | nop_e
Hi all I just got feedback from my customer about "White residue problem" around solder joints with manaul soldered connector at customer site and included the failure analysis report that there is residues of Cl,S,Na . I 'd like to know, the whi
