Electronics Forum | Wed May 21 08:16:57 EDT 2008 | tonyamenson
Good morning gentlemen, I could use some advise as to the min / max windows for the wave process. We have had little problems with our leaded wave but when applying the same process to lead-free wave we are having problems. Obvisouly the temps are
Electronics Forum | Wed Aug 27 14:38:20 EDT 2008 | rgduval
Does your paste provider recommend a TAL? For the leaded and lead-free pastes that we use, the manufacturer recommends 60 seconds above liquidous. I note that your profile shows the TAL as 30 seconds, which may not be sufficient. That said, tho
Electronics Forum | Mon Sep 22 15:32:20 EDT 2008 | davef
We see this fairly often. It doesn't affect solderability. Our analysis makes us think this coloration is copper. The reason copper appears on the surface may be that heat cycles increase the thinness and porosity of the immersion silver [IAg] coatin
Electronics Forum | Wed Mar 04 08:21:42 EST 2009 | rgduval
It seems familiar, but nothing that I've actually experienced. I've read some articles about tin-whiskering in lead-free solder. I think NASA has some pretty good analysis (or, at least they did a couple of years ago). The summary is that without
Electronics Forum | Wed Apr 22 11:58:16 EDT 2009 | markhoch
Quick Question! We have an assembly that we're building for a customer that will have to be soldered via a Lead-Free Wave Solder. We do not currently have a Lead-Free Wave Solder in house. Does anyone know of a company that may be able to provide thi
Electronics Forum | Fri Feb 19 12:58:33 EST 2010 | patrickbruneel
Loco, If after reading these articles you still don’t believe Toyota went lead free let me know. Toyota developed their own lead free alloy http://sciencelinks.jp/j-east/article/200016/000020001600A0589899.php Quote” Several engineers are readyin
Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef
SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s
Electronics Forum | Thu Sep 19 10:22:14 EDT 2013 | rgduval
With the Pb-Free BGA on there, you'll want to use pb-free solder paste for assembly. The logical course of action would be to use Pb-free solder paste for the entire assembly, and to reflow at the temperatures necessary for the BGA and Pb-free paste
Electronics Forum | Sun Jun 22 13:24:49 EDT 2014 | davef
I don't know. We never had craziness like this before lead-free. You should have the yellowish-metal analyzed to be sure. Guessing: You're seeing this color on the terminations of components, not on the bulk of the SnX solder connection. If that's
Electronics Forum | Mon Feb 06 17:19:59 EST 2017 | davef
Evtimov: IDEALS Project was one of the first to talk about componebt and board damage caused by LF soldering temperatures. There's lots of more current stuff on the web. Here's some that may help: * Assessment of Long-term Reliability in Lead-free As
