Electronics Forum: ones (Page 725 of 1373)

PGA, uBGA, CSP, FC - Technology

Electronics Forum | Mon Feb 02 08:51:52 EST 2004 | emeto

Hello all! That;s not practical one. Can you please tell me where I could find information about PGA uBGA and CSP? I need some historical information what is the technology and topology of the packages, different types Packages. For CSP and FC I a

Contact System CS-400 E problems

Electronics Forum | Mon Feb 02 16:30:46 EST 2004 | paul_bmc

I have one machine that I am having trouble getting the machine to recognize an offset. I keep getting the error, "When correcting Offset 1: Invalid offset, press 'esc". Does anyone know what I am doing wrong. On another machine I have I keep havi

SMT Equipment

Electronics Forum | Mon Feb 16 01:26:30 EST 2004 | Frank

The 575 was based on the 570 machine. The 570 was Juki's first laser centered machine. It can do 0402 and ICs with a pitch of 0.65mm or greater. The 575, was a re-vamped 570 that Zevatech came up with. Juki played no part in the 575. Zevatech ad

Conductive Adhesives and flip chip

Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan

HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver

Component stencils

Electronics Forum | Wed Feb 11 18:21:39 EST 2004 | Steve

Does anybody know if there is such a thing as individual component paste stencils, and who would sell such an item? The reason I am asking is because we have instances when we build prototypes that we don't need a full stencil. We may only need to pl

Manufacturing faults - data collection systems

Electronics Forum | Wed Apr 14 10:58:12 EDT 2004 | heatherc

Aegis software offers an MES system that offers both automated and manual data collection points. All of the data collected is automatically deposited in one central database. This database is then used for generating all of the SPC reports for ana

.5mm BGA

Electronics Forum | Fri Feb 20 15:46:44 EST 2004 | russ

Kinda what I thought, Ken, what would the parameters be relating to sphericity, flux, etc... We use type 3 63/37 usually watersoluble but for this I think I'm gonna have to use no-clean paste. When you say it can be done, what exactly does that

.5mm BGA

Electronics Forum | Sat Feb 21 11:59:22 EST 2004 | Ken

sphericity and consistency are important. egg shaped, dog-boned shape snd tear-drops work against you and promote clogging and in-effective "transfer efficiency". One of the most signifficant factors will be brand/type. Not all fluxes are created

PCB wave dams

Electronics Forum | Fri Feb 27 15:48:13 EST 2004 | pdeuel

Dose anybody know of a method of preventing board sag in the wave process. We have a 2 year old Deltawave. The product we are running is a one sided 10in x 12in panel of 6 PCB's. Pin headers and connectors are near all of the edges. Our current board

BGA/Fine pitch footprints

Electronics Forum | Tue Mar 02 10:19:41 EST 2004 | loz

Hi all, we have recently seen a design that consists off a QFP100, pitch at 25". Also in the centre of this footprint is a FBGA165 footprint, pad size .4mm @ 1mm pitch. We have been informed that we will fit the QFP. I want to remove the BGA pads fr


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