Electronics Forum | Sun Jul 29 23:58:08 EDT 2001 | Frank
Hi Dave Thanks for your information. The problem that I found is paste not stick well on pads ( solder paste printing process). When the table move down (PCB saperate from stencil) some of paste stick on aperture instead pads. Solder paste : Delta
Electronics Forum | Wed Jan 26 21:23:51 EST 2000 | Dennis
Hello! all Will anybody give me advice for missing componets for 0402, 0603 R or C chips? I am not gonna tell you which machine I use, but from my experience, every p&p machine has possibility for missing component after placing 400 or more componen
Electronics Forum | Wed Sep 22 12:23:11 EDT 2004 | Peter Barton
FYI Label on the back of my charger says the following: Pt. No. WD23D200KCN PSU E31-0900-21 Input 230 V AC Output 9V DC, 0.2A 1.8VA Ours is of course United Kingdom type, even if the mains plug is European and requires an adaptor. Not too sure a
Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514
Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh
Electronics Forum | Tue Mar 07 14:18:32 EST 2006 | James
Billy, I have to disagree with you. We inadvertently soldered a Pb BGA with SAC305 paste and then had it micro sectioned and spectrum analyzed. Imagine our surprise when we saw the spectrum analysis showed Pb. The micro sections showed none to ac
Electronics Forum | Mon Mar 20 03:47:16 EST 2006 | Adrian
Hi guys, Has anyone ever had experiance with a Vision Master 150 ?, we have 2 onsite and I am trying to get accurate BGA paste height measurements from this machine, but both the machines are giving me results with huge variations, like +/- 0.2 thou
Electronics Forum | Wed May 17 23:59:16 EDT 2006 | KEN
Repeatability data please. Please provide source. Can you provide the standard deviation and sample size please. Does this data represent all major angles? Was this data independently verified? Was this data collected using glass parts or p
Electronics Forum | Sun Aug 27 06:32:24 EDT 2006 | mika
Many Thanks to You all. I think we should be ok with the majorty of our cap's if we set the comp. thicknes to 0.2 mm less than the actual size to be able to compensate for the variable thicknes from different wendors for a certain component. Do You
Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev
Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas
Electronics Forum | Fri Apr 06 16:36:39 EDT 2007 | mika
Ah, I almost forget (forgot?) to mention that according to the Gerber files (which is the info we send to the PCB-house) the PCB land pattern for this LGA-36 0.35mm rounded pads and the boardhouse cannot achieve this. I understand them; 0.35mm pads,
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