Electronics Forum: 5mils (Page 8 of 35)

Stencil Thickness

Electronics Forum | Thu Jun 21 07:21:26 EDT 2007 | chrispy1963

5 mil is perfect for 0402's. If you are printing SnPb solder use apeture reduction such as home plating the pads. However, if youre using SAC, we've found that printing the entire pad works best due to poor wetting compared to SnPb paste. Chris

Stencil Thickness

Electronics Forum | Fri Jun 22 10:56:07 EDT 2007 | ed_faranda

5mil works great. Just make sure that you screen alignment is dead on. We're using a SAC305 with a home plate design. I ran a test a couple of months back and found that the home plate design works the best with 0402s.

Stencil Thickness

Electronics Forum | Wed Jun 27 21:16:20 EDT 2007 | rfrog

5 mil will treat you just fine. Do some research on stencil area ratio and aspect ratio if you ever reduce your aperture sizes any further.

QFN soldering

Electronics Forum | Thu Nov 15 09:29:03 EST 2007 | jaimebc

Just to add to the subject, we experienced insufficient solder on our QFN's at our prototype level. To correct it, we went to a 5 mil stencil, 20% reduction on QFN pertures and used QFN's with solder bumps on the pads. We had great results using thi

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Jan 09 19:04:48 EST 2008 | pnguyvu

5 mil thick is the max and no reduction Any question feel free give me a call @ 714-636-6211 or email me Steve@usastencils.com Regards Steve

GSM camera lens

Electronics Forum | Mon Jan 14 08:56:30 EST 2008 | geb

Hi, The machine is a Universal GSM1 flexhead. Is it possible to just change the lens of a 2.6mil camera for a 1mil or 0.5mil lens. Or do I have to buy a complete camera assembly to do this? Thanks, Grant

Stencil Design

Electronics Forum | Tue Sep 16 21:52:19 EDT 2008 | rayjr1491

10x16 by 5 mil stencil gives me a area ratio of .615 unless I am calculating incorrectly. I will try and attach some images tomorrow. By reducing the Y direction my area ratio s below .6 and I thought this was not advisable. Your help is muc appreci

paste release

Electronics Forum | Fri Feb 05 09:40:45 EST 2010 | denisp

Hi! i would like to have opinion about the solder paste release. is it better on a 5mil or 6 mil thickness stencil? thank you!

Fine Pitch Printing Issues

Electronics Forum | Thu May 20 16:30:50 EDT 2010 | mikesewell

I believe industry standard is 1/2 pitch for fine pitch devices. If your part is 20 mil pitch, apts would be 10 mil wide. This should gasket fine to the pcb pad and with a 5 mil stencil should print well.

Reflow Oven with Vacuum System

Electronics Forum | Wed Jun 09 12:11:11 EDT 2010 | sjohnson

We have been doing pilot runs with vacuum installed on vapor phase. Voids are down but bridges are up on the .5mil BGAs.


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