Electronics Forum | Wed Sep 23 15:37:58 EDT 1998 | Michael Allen
We've had success with AirVac's DRS-22 system. Their people seem to understand the rework process better than many other suppliers. I'm sure you can find them on the Web. Note: When looking at a competing supplier's equipment last year, the demo gu
Electronics Forum | Mon Apr 12 09:09:25 EDT 2004 | russ
If they are reflowing pbfree balls to bare PCB pads they are getting that component very hot tpo melt the balls and get them to wet to the pads! I would not recommend this process at all for hightemp solder balls, for 63/37 this process is fine. As
Electronics Forum | Thu Jan 19 06:25:42 EST 2006 | bwet
There are several life studies (see for example http://www.solder.net/stencilquik/articles.asp) which point to higher reliability of reworked BGAs using solder paste vs flux. The theory on the mechanisms which allow this to happen are as follows: 1
Electronics Forum | Thu Dec 21 15:11:53 EST 2006 | billyd
Hey fellas. Listen, I'm trying to see what the industry as a whole is doing with regard to placement and reflow of the tiny QFN devices. Not the larger ones, but the 4mm or 5mm ones. We struggled a bit with a QFN24, 5mm square. The thermal pad undern
Electronics Forum | Mon Apr 23 16:27:28 EDT 2007 | davef
"If you wanna get a "warm n fuzzy" that your cleaner is capable of doing the job. One thing you can do is what I was taught when selecting a cleaner to buy, is get yourself some glass plates (heat resistant tempered glass to be sure!) and make yourse
Electronics Forum | Wed Feb 03 22:37:50 EST 1999 | Dave F
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Fri Aug 06 15:32:03 EDT 2004 | Shean Dalton
Thanks for providing the pictures. We evaluated what we could see and have the following idea's. 1) Because of different thermal charatoristics between the topline and your product, your Motorola BGA solder joints may have experienced a higher refl
Electronics Forum | Wed Jan 23 01:24:45 EST 2008 | dragonslong
Hi ppl, i just joined my company as a quality engineer and was revising our incoming visual inspection. I was reading the IPC guidelines of IPC-7095. However, i have some problems which i hope the experts from this forum could help. IPC-7095: At on
Electronics Forum | Mon Feb 25 11:12:32 EST 2008 | hegemon
It sounds more as though you have a profiling problem primarily, however, if your placement is not square to the board, then you should get your machine setup correct first. After that you can get to the profiling. If the BGA is brought up to tempe
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
