Industry Directory | Consultant / Service Provider
Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)
The MK-838 is used for efficient and flexible high yield wafer bumping as well as hybrid applications. Shown with Pressure Chamber for superior paste release and automatic substrate handling.
Industry Directory | Manufacturer
Manufacturers of Automated Optical Inspection
STI is the leading manufactore of 2D/3D Automated visual defect inspection equipment. We offer the All-In-One soulution for inspecting Active Die, Probe Mark, Ink Dot & 2D/3D Bumped Wafers (including 300mm). .
Industry Directory | Manufacturer
Wafer Dicing, Die Attach, Wirebond, Glob Top, Semiconductor Packaging, RF Assemblies, SMT, PCB Assembly, Chip-on-Board, Multi-Chip Modules, Die Stacking, Flipchip, Stud Bumping, Prototyping, Process Development, Proof of Concept.
Used SMT Equipment | Pick and Place/Feeders
FUJI VPD Plus IBE SMT Inventory ID : 110516-016 FUJI Serial Number : 0035 Vintage : 2008 Details •Model: MPA 4000 •Includes Dongle and Dell PC Click Here for more information or to request a quotation... Specifications ( See Details abov
Used SMT Equipment | Semiconductor & Solar
Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
New Equipment | Test Equipment - Bond Testers
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av
Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
