Industry News: ceramic pcb bonding (Page 8 of 31)

BTU’s Fred Dimock Participates in Vacuum Reflow Panel Discussion

Industry News | 2019-12-21 16:23:58.0

BTU International, Inc. is pleased to announce that Fred Dimock, Manager of Process Technology, will participate in a panel discussion on vacuum reflow with respected industry experts. The panel is scheduled to take place Thursday, Jan. 16, 2020, at L3Harris Technologies in Palm Bay, Florida.

BTU International

BTU's Fred Dimock to Participate in 'Automation and Energy Conservation in the Reflow Process' Panel Discussion

Industry News | 2020-05-12 12:57:11.0

BTU International, Inc. is pleased to announce that Fred Dimock, manager of process technology, will participate in a live panel discussion on Tuesday, May 19, 2020. The discussion entitled, "Automation and Energy Conservation in the Reflow Process," will be hosted by Global SMT & Packaging magazine.

BTU International

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited

Polyonics Adds New Double-Coated Polyimide Options to its Family of High Temperature Engineered Tapes

Industry News | 2012-02-10 15:56:15.0

The new Polyonics double-coated tapes are ideal for bonding materials that will be exposed to extremly high temperatures and harsh manufacturing environments. They include liners that are designed to be die cut and, due to their additional stiffness compared to transfer adhesives, can be easily auto-applied.

Polyonics, Inc.

VJ Electronix Adds Two New Service Engineers

Industry News | 2018-11-16 15:41:35.0

VJ Electronix is pleased to announce the addition of two Service Engineers based out of its Chelmsford, MA headquarters. David Marchesini and Keith Desharnais have joined the VJE team to expand the group’s capabilities and improve customer service support.

VJ Electronix

NPL New 2019 Webinars are Launched

Industry News | 2018-11-20 06:46:05.0

The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research http://www.npl.co.uk/science-technology/electronics-interconnection/webinars/

ASKbobwillis.com

Perllo Technologies Introduces Extec�s new line of Steel-Inked and 3-D Thick Film Hybrid Technology into US Marketplace

Industry News | 2004-11-19 15:47:39.0

Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.

Perllo Technologies

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Industry News | 2017-01-29 09:37:08.0

TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

Speedline Technologies, Inc.

BTU Expands Reflow Oven Distribution in Germany with Stratus Vision

Industry News | 2022-05-05 17:02:34.0

BTU International, Inc. is pleased to announce that it has expanded its distribution relationship with Stratus Vision GmbH to include PYRAMAX reflow ovens in Germany, Austria and Switzerland.

BTU International

Seika Machinery to Showcase Sayaka PCB Routers at APEX 2009

Industry News | 2009-03-20 17:24:43.0

TORRANCE, CA � March 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit Sayaka PCB Routers in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Seika Machinery, Inc.


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