Full Site - : conducter spacing (Page 8 of 33)

ThermalWorks

Industry Directory | Manufacturer

Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology

Shenzhen PEAK Technology Co., Ltd

Industry Directory | Manufacturer

Military Certified PCB Fabrication & Circuit Board Assembly Manufacturer Custom PCB fabrication in as little as 8 hours – All you have to do is ask! 16 Years Of PCB Manufacturing - Serving Electronic Since 2001

Durastat Trays

Durastat Trays

New Equipment | Board Handling - Storage

Highly Reusable Stackable Eliminates Bags Durable Option: Partitions or Inserts DuraStat ESD Tray is a reusable conductive 4mm, fluted plastic, stackable tote design that maximizes space and minimizes weight. The tray includes a dissipative c

Conductive Containers, Inc.

IPC J-STD-001 Space Addendum (CIT) Certification Training Course

Training Courses | ON DEMAND | | IPC J-STD-001 Space Trainer (CIT)

The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.

BEST IPC Training

Conductive Anodic Filament Growth Failure

Technical Library | 2021-07-27 14:59:56.0

With increasing focus on reliability and miniaturized designs, Conductive Anodic Filament (CAF) as failure mechanism is gaining a lot of attention. Smaller geometries make the printed circuit board (PCB) susceptible to conductive anodic filament growth. Isola has carried out work to characterize the CAF susceptibility of various resin systems under different process and design conditions. Tests were carried out to determine the effect of various factors such as resin systems, glass finishes, voltage bias and hole and line spacings on the CAF resistance. This work was intended to provide information to the user on the suitability of various grades for specific end use applications. The focus of the work at Isola is to find the right combination of process and design conditions for improved CAF resistant products.

Isola Group

Conductive Adhesives Increase Microchip Packaging Density

Technical Library | 2010-06-24 21:20:05.0

Cost-effective assembly of custom-designed microelectromechanical systems (MEMS) for medium-caliber fuzes is challenging. In particular, the environment must have a setback acceleration exceeding 60,000g and centripetal acceleration of 9000g/mm out of center in a 30mm#2;173 projectile. In addition, the space available is very limited. The traditional approach is to mount the MEMS chip in a package that is then soldered to the printed circuit board (PCB). However, by mounting the MEMS chip directly to the PCB using conductive adhesive, we can increase the packaging density while reducing manufacturing cost.

SPIE - International Society for Optical Engineering

Characterization, Prevention and Removal of Particulate Matter on Printed Circuit Boards

Technical Library | 2016-12-22 16:44:04.0

Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH) of the particulate matter. In wet condition, particulate matter can electrically bridge closely spaced features on printed circuit boards (PCBs), leading to their electrical failure. (...) The objective of this paper is to develop and describe a practical, routine means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.

IBM Corporation

HTCC ceramic feedthrough package 14pin butterfly package TOSA VOSA package, DPSK hermetic package with window lens RF connector

HTCC ceramic feedthrough package 14pin butterfly package TOSA VOSA package, DPSK hermetic package with window lens RF connector

New Equipment | Other

1. HTCC Ceramic Feedthrus 2. High Frequency Design, upto 10Ghz ideal for high speed devices 3. Enhanced thermal conductivity, ideal for TEC installation 4. DWDM, WWDM, WDM, EDFA, tunable laser, EA, SOA, and CW Optical Packages for the industries of

China Streamtek Electronics Co., Ltd

PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks

Technical Library | 2015-12-23 16:57:27.0

The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.

Raytheon

Refurbished Agilent Gas Chromatography System

Refurbished Agilent Gas Chromatography System

New Equipment | Test Equipment

Fully refurbished with warranty. We provide a test results report to verify that the instrument meets all relevant specifications. Customized to run your method. GC Models: 7890 6890 A 6890 Plus 6890 N 6850 5890 Series II Plus 5890 Series I

GenTech Scientific


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