Electronics Forum | Thu Jun 03 15:15:09 EDT 1999 | J.S.
| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa
Electronics Forum | Mon Mar 30 16:02:44 EST 1998 | Michael Allen
| We have successfully put .016" vias in .030" pads. | There is no issue with .030" solder balls, since | the actual volume of the .002" via in pad is small | compared to the ball+solder paste volume. | We did notice random bubbles where, apparentl
Electronics Forum | Wed Oct 23 16:17:17 EDT 2002 | nwyatt
CSP is similar to BGA process in that you need to undergo a reflow process to properly solder the chip. Also, a soak period is desirable to promote outgassing. You do not need nitrogen. We are building CSPs in a regular convection oven without n
Electronics Forum | Wed May 07 08:10:22 EDT 2003 | Pon
Hi all Are there any advice pls. let me know. Our customer Void spec. at BGA and CSP is less than 10%. Usually we found void defect at BGA and CSP component around 2-3 % but sone lot the defect rate is up to 18%. I have read some input from this w
Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef
Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad
Electronics Forum | Tue Aug 01 16:42:45 EDT 2000 | Robert Hartmann
Our company is putting a BGA/CSP package assembly line together. We have been studying different assembly houses reliability (short and long term) monitoring programs. I was wondering if some of you who use BGA's/CSP's for your MCM's and Hybrid's
Electronics Forum | Fri Jul 13 00:11:41 EDT 2001 | qinongzhu
We are preparing a batch of samples for test. several IC which packaged by BGA/CSP was removed from PCB by reworkstation. However, I need to re-use this IC. I want to know whether there is a way to remove the solder balls from these IC devices and ca
Electronics Forum | Tue Oct 05 00:10:01 EDT 1999 | karlin
Hi, Help! Could anyone help to enlighten me on this? Question: If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water clean washing ma
Electronics Forum | Tue Oct 05 13:30:23 EDT 1999 | Debbie Alavezos
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Fri Feb 07 15:17:14 EST 2003 | MA/NY DDave
Hi I am pretty sure it isn't the pad that is causing the problem. To me it seems like those via holes through the pcb either to an internal plane or to the other side. I can imagine creating an interesting stencil to accomodate the vias yet you are
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