Used SMT Equipment | Pick and Place/Feeders
Device Name: Samsung SM411, Samsung SM411 Mater, Second-hand Samsung SM411 Mater Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH and
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base
Used SMT Equipment | Pick and Place/Feeders
Siemens placement machine D4I, SIPLACE D4i high-speed placement machine Model description: 1. Number of cantilevers: 4 2. Number of placement heads: 4 3. IPC speed: 57.000cph 4. SIPLACE benchmark evaluation: 66.000cph 5. Theoretical speed: 81.50
Used SMT Equipment | Pick and Place/Feeders
Siemens placement machine D4I, SIPLACE D4i high-speed placement machine Model description: 1. Number of cantilevers: 4 2. Number of placement heads: 4 3. IPC speed: 57.000cph 4. SIPLACE benchmark evaluation: 66.000cph 5. Theoretical speed: 81.50
Used SMT Equipment | Pick and Place/Feeders
The JUKI high-speed placement machine FX-1R is compatible with the linear motor used in high-speed placement and the unique HI-Drive mechanism. It inherits the traditional concept of a modular placement machine and realizes a high-speed placement m
Events Calendar | Fri Oct 19 00:00:00 EDT 2018 - Fri Oct 19 00:00:00 EDT 2018 | Bannockburn, Illinois USA
Assessing the Health of the Defense Electronics Industrial Base Industry Workshop
Used SMT Equipment | Pick and Place/Feeders
SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm~maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm~Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
Used SMT Equipment | Pick and Place/Feeders
Samsung SM320 Pick and Place Machine Specifications: Chip theoretical speed :18500CPH Mounting range 0402mm Chip ~ □ 55mm IC Placement accuracy plus or minus 0.03mm PCB size 510 * 460-460 * 400mm Equipment size 50 x 40 mm ~ 460 x 400mm Co
Used SMT Equipment | Pick and Place/Feeders
IPLACE D4 is a very powerful placement machine, equipped with four cantilevers and four 12-nozzle collection and placement heads, not only can achieve a precision of 50 microns, but also can mount 01005 components. ***Combining*** and ***flexibility
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100