Electronics Forum | Tue Aug 07 01:16:27 EDT 2001 | mugen
When I was reading the smartsonic fantasy, I ended hospitalized for infectious laughs, and side split'in stitches..... Now that cold reality has eased my pain, I must with calm headed purpose, mark my agreement to the Mr.Sean, that salespersons can
Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup
Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or
Electronics Forum | Wed Jun 21 13:25:16 EDT 2006 | muse95
I see what you're saying - I'm not a process guru by any means. I was going on the premise that SAC melts at a higher temperature than SnPb. Basically I think of it as a BGA is joining solder to solder, unlike an SOIC where it is tinned metal lead t
Electronics Forum | Tue Jun 05 14:36:55 EDT 2007 | stepheniii
No. It was CK who brought up AC at his home and erroneously said that having your AC on a lower setting used less power than having it turned off when you are not there. I'm saying with AC at home turn it off when you are not there and have it come
Electronics Forum | Wed Mar 21 13:16:11 EDT 2012 | grahamcooper22
What solder alloy are you using at the moment which is coming to the end of its limits ? Normally in general for safe operation of an alloy we don't like to recommend any operation temp that is higher then two thirds of the solders melt point, but th
Electronics Forum | Thu Mar 13 14:12:31 EDT 2014 | davef
You're creating a new alloy on the surface of your board. The alloy will have a melting point determined by the constituent metals of the alloy. Your alloy consists of: * Lead-free HASL solderability protection on the board * Lead-free solder paste *
Electronics Forum | Tue Aug 22 15:34:55 EDT 2000 | Dr. Ning-Cheng Lee
An example of very low melting point Pb-free solder is 58Bi/42Sn. Different versions of this alloys have been tried, such as doping with various additives, in order to enhance the reliability further. Yes, Bi is one element which promises low mp for
Electronics Forum | Thu Feb 10 16:00:31 EST 2000 | Travis Slaughter
I have had cases when it was necessary to run epoxy and paste at the same time. The only good reason I know of to even think about messing with going to this trouble is if the surface tension of the solder melting pulls the part out of alignment. T
Electronics Forum | Sat Nov 06 14:58:45 EST 1999 | Gary Moravchik
Assuming you are using Sn63/Pb37 solder paste, have you tried using a lower temp melting point solder paste for the second pass? For example, use 63/37 for first pass and a Bi58 compound solder paste for the second pass. If I recall, Bi58's melting
Electronics Forum | Thu Feb 05 15:38:21 EST 2004 | mrmaint
Pete C We do bake our tray parts. I am familiar with the ipc specs. The problem is for example: a level 4 component can only be out a total of 72 hrs before rebake is required. If this is a tube or reel part, the 125c bake temp that is recommended wi
