Electronics Forum: nj (Page 8 of 14)

Re: How to measure N2 in reflow oven

Electronics Forum | Thu Mar 04 08:50:53 EST 1999 | Dave F

| | I need to setup an oven to run with a nitrogen atmosphere for | boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional built-in

seeking an equipment vendor for prototyping Surface Mount PC boards

Electronics Forum | Wed Feb 17 08:58:50 EST 1999 | Brian G Bancroft

Hello Admin: I am looking for a vneodr or vendors who specialize in a bench top-size Surface mount assembly/soldering station for prototyping PCBs with surface mount resistors. the unit needs to have: micro-manipulators binocular magn

Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F

| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga

| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark

| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce

Re: Conductive Adhesives

Electronics Forum | Wed Jan 06 10:35:55 EST 1999 | Chrys

| | I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, | | | | Chrys | | | Hey

Re: Conductive Adhesives

Electronics Forum | Wed Jan 06 13:24:25 EST 1999 | Dave F

| | | I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, | | | | | | Chrys | | |

Double-sided reflow process.

Electronics Forum | Thu Oct 08 22:32:53 EDT 1998 | E.

*Reply to: ericr@nj.tanon.com Without going into a lengthy explaination {at this time}, has anyone experimented, tested, evaluate, and/or 'perfected' an SMT double-side reflow process. Presently I'm using a Kester R593 OA (water soluble) Sn63/Pb37 -

Water Soluble flux

Electronics Forum | Wed Oct 07 22:40:05 EDT 1998 | Eric R.

Came a cross an interseting observation/question. I'll need to filter additional information and specifics to those whom may be able to assist me. But for now; I use a water soluble base organic flux manufactured by Kester (the exact solution will


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