Industry News | 2014-05-12 11:02:56.0
DDM Novastar introduces new entry-level pick and place machine.
Industry News | 2013-11-27 15:30:07.0
Martin introduced its new rework Process Shuttle that streamlines flux and solder paste dipping or printing, and pre-positions the smallest surface mountable devices (SMDs) for pickup. This enhancement to the company's EXPERT 10.6 rework system was designed to increase the efficiency and quality of the work performed.
New Equipment | Test Equipment
SAKI AOI BF-Frontier II Resolution 18μm Board size:460×500mm Dimension:850 × 1340 × 1230mm weight:450kg Product description: SAKI AOI BF-Frontier II, Resolution 18μm, Board size:460×500mm, Dimension:850 ×
New Equipment | Test Equipment
SAKI 2D AOI BF-Planet-X II Resolution 10μm Board size:330x250mm Dimension:600 × 915 × 1270mm weight:Approx. 275kg Product description: SAKI 2D AOI BF-Planet-X II Smallest footprint, inline, high speed， Resolution 10μm, Board
SAKI AOI BF-Frontier II Resolution 18μm Board size:460×500mm Dimension:850 × 1340 × 1230mm weight:450kg Product description: SAKI AOI BF-Frontier II, Resolution 18μm, Board size:460×500mm, Dimension:850 × 1340 × 1230mm, weight:450kg INQU
SAKI 2D AOI BF-Planet-X II Resolution 10μm Board size:330x250mm Dimension:600 × 915 × 1270mm, weight:Approx. 275kg Product description: SAKI 2D AOI BF-Planet-X II Smallest footprint, inline, high speed， Resolution 10μm, Board size:330x250mm,
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Flason SMT Yamaha Super high speed Modular Surface Mounter YS24 Speed: 72,000 CPH Applicable PCB:L50×W50mm - L700×W460mm Weight:1700KG Dimension:L1,254×W1,687×H1,445mm Product description: Yamaha Super high speed Modul
DAGE XD7500 TR Open Tube 160KVa PCB BGA X-Ray machine PCB size:50x60-330x330mm Dimension:850x1430x1500mm weight:850KG X-Ray machine Product description: DAGE XD7500 TR Open Tube 160KVa PCB BGA X-Ray machine, PCB size:50x60-330x330mm, Dimensio
Yamaha YS24X Pick and Place Machine Mounting Capability: 54,000CPH Board size: L50xW50mm to L700xW460mm Applicable Components: s 0402 - 45mm × 45mm, Height 15mm or less Weight: Approx. 1,700KG Product description: Yamaha YS24X Pick and Place M
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