Electronics Forum: profiles tombstoning (Page 8 of 17)

HIP defect in BGA

Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan

Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ

Re: Tombstoning

Electronics Forum | Tue Oct 12 16:08:44 EDT 1999 | Brian

| I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.

Tombstone defect

Electronics Forum | Mon May 05 03:53:41 EDT 2003 | praveen

Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.

Tombstone defect

Electronics Forum | Mon May 05 03:53:47 EDT 2003 | praveen

Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.

Chip Components with big ground pads - Unsolder

Electronics Forum | Mon Jan 26 04:13:48 EST 2004 | patthemack

First of all, did you profile this board with a mole, such as a KIC? Is the solder flowing, or just not wetting to the part or pad? I work with RF boards as well, but the main problem is tombstoning due to the ground plane side being larger because o

Tombstone caused by flux residue

Electronics Forum | Thu Jul 07 17:08:28 EDT 2005 | Inds

how fast are you ramping your profile..and how long are you soaking it.. are you giving enough time for the flux to get activated...

Quad 1000, looking for opinion

Electronics Forum | Thu Nov 03 10:43:04 EST 2005 | russ

Good Luck! Good profile and correct pad design will make for an easy 0402 and 0201 without tombstone process.

0402 PARTS

Electronics Forum | Wed Jul 01 08:15:13 EDT 2009 | dwelch123

You can use regular paste and a .005 stencil will help reduce tombstones. It's just that easy. I run 0402's all the time without any problem, just make sure your profile is a good one!


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