Full Site - : silver finish problems on the reflow (Page 8 of 13)

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon

| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon

| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 15:27:36 EDT 1998 | Dave F

| | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and s

Gold Surface Finish on PCB's

Electronics Forum | Tue Dec 13 22:44:35 EST 2005 | Mike Kennedy

Russ, After a bit more research, I have found that the FLASH gold process doesnt use Phophrous in the process so should not have the black pad problems of ENIG. I am now surprised that you had problems. What did you experience? Was it an oxsidisation

headers skewing on alluminum board

Electronics Forum | Fri May 01 21:10:22 EDT 2015 | sarason

They are probably getting a little hot. So that leaves several courses of action. 1: Don't place them before reflow and hand finish. 2: Shield them with a little folded shield to decrease heat transfer. 3: Speed up the time through the oven, but th

Solder contamination on Golden Finger

Electronics Forum | Sat Aug 11 13:37:02 EDT 2007 | shing

I am a fresh SMT engineer. I am now facing a problems, solder contamination on Golden Finger nearly about 1 year. I don't know what going on. I have checked the cleaningness of stencil, solder paste handling,IR re-flow profile and even PCB surface

Latent shorts on QFN package

Electronics Forum | Fri Mar 06 10:32:34 EST 2009 | fountain42

Yes, We've already experienced this same problem. 1) What kind of flux are you using? No Clean? Rosin? OA? 2) If it's OA, What kind of water wash do you do? Do you use DI water? How Hot? Who's machine? What are the pressures? 3) Have you performed a

Regarding OSP PCBA shelf life.This is based on the thread (#73465 PCB SHELF LIFE AFTER FIRST REFLOW | 9 February, 2015)

Electronics Forum | Thu Nov 30 00:41:23 EST 2017 | abhilash4788

Dear All, I have OSP finsh pcb on my production, the pcb thickness is 1.5mm and the product is one sideded pcba. After reflow process, Is there any specific time frame defined for smt completed OSP finish pcba before going for wave soldering proce


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