Electronics Forum | Thu Mar 25 13:31:42 EST 2004 | Ren�
Hi Daniele: In a design of experiments with four methods for attaching thermocouples : High Temperature Solder, Aluminum Tape (Chomerics T405), Kapton Tape and Conductive Epoxy (Loctite Tak Pak 382. The most reliable method is high temperature solde
Electronics Forum | Fri May 20 03:41:04 EDT 2016 | jpcwg
With power components coming in smaller and smaller surface mount packages it is very important to come up with a coherent approach to mitigating the thermal dissipation requirements of these components in a PCB design. While the development of an ex
Electronics Forum | Thu Jun 18 10:57:28 EDT 1998 | Mike Moninger
| We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | Now,
Electronics Forum | Wed Aug 01 11:11:38 EDT 2001 | JohnW
hi Folk's, Ok so I'm looking for some thoughts on Conductive Epoxy's. I'm trying to replace a material that i can place between a QFP and the PCB to transfer heat from the component to the PCB. The material has to be able to be injected thro' a hole
Electronics Forum | Tue Jan 05 18:19:40 EST 1999 | Dave F
| I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, | | Chrys | Hey Chrys: I
Electronics Forum | Mon Jun 06 09:05:02 EDT 2005 | cmiller
How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni
Electronics Forum | Mon Jun 06 10:02:39 EDT 2005 | cmiller
How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni
Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef
Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co
Electronics Forum | Tue Apr 13 19:47:05 EDT 2004 | davef
Glue has different mechanical, thermal, and electrical properties than solder. That's why all these very nice no-lead people are furiously trying to gin-up some wacky solder alloy, rather than using glue. Among the papers in the SMTA Knowledge base
Electronics Forum | Wed Feb 16 15:29:15 EST 2000 | John S.
My company manufactures electronic modules for the automotive industry. We have a current product that the customer would like a "heavy duty" version of. The module will have to handle roughly twice as much power as the original. A couple of compo
