Electronics Forum: type 4 (Page 8 of 96)

Stencil Design

Electronics Forum | Mon Jun 01 18:44:54 EDT 2009 | scunneen

Hello there, I have a new board, fairly heavily populated with a number of FPBGA on it. The smallest has a pitch of .4mm.I have 3 questions, 1st what is the best appeture for this small pitch. 2 Will type 3 paste work or will I need type 4, and fina

MPM Ultraflex 3000 password

Electronics Forum | Mon Apr 18 12:52:41 EDT 2005 | paulhaines2000

Try this - it's for a UP3000 but might work for you... Operator � no password Supervisor � mpm2 Maintenance � mpm3 Manufacturing � mpm4 Field Service � mpm4 1. To change or view codes, �esc� from program and go into DOS. 2. Type �cd\ULTRA\CONFIG�

How to disable feeder slots

Electronics Forum | Tue Dec 20 16:47:22 EST 2005 | toml

Parameters -> Cameras) Look at the camera serial tag and you should see C4 or OAL or C4 OAL. Make sure the camera type is set to strobed RS170 (C4) or whatever type you have. Then set defaults for this camera, and power cycle. This will fix the f

Re: MicroBGA printing problem

Electronics Forum | Tue Sep 21 11:28:26 EDT 1999 | Dave F

| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi

0.4 mm Pitch BGA stencil design

Electronics Forum | Mon Nov 01 10:29:13 EDT 2010 | scottp

I've searched the archives and maybe my search skills aren't up to snuff but I couldn't find much. I'm curious what people are doing for 0.4 mm pitch BGAs, assuming a type 4 paste. Pad diameter? SMD or NSMD? Stencil thickness? Aperture diameter? Us

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 07:16:40 EDT 2005 | jdumont

Thanks a lot guys. The part dims are in mm by the way. So last night i was looking at the .pcb file and saw that the pad size and stencil are both .013" while the ball on the BGA is .018" (sorry for switching from metric). Is this ok or can i have en

Solder Coverage in Non ROHS Paste

Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr

Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem

Small apperture release from stencil

Electronics Forum | Fri Feb 15 12:51:30 EST 2013 | emeto

Hi MikeS, I didn't post all the information, because I didn't want to mislead you. I wanted to see your way. We tried 3mil and 4 mil stencil using type 4 paste. It was hard to get the right aspect ratio and that;s why we did it on Nickel stencil - a

SMT voiding

Electronics Forum | Thu Nov 01 10:52:06 EDT 2012 | kris1128

Hello kkay, can I ask what type of solder paste the #4 sample was? Thanks!

Solder climbs on the lead and touches the body of the component

Electronics Forum | Mon May 12 13:55:19 EDT 2014 | hegemon

It sounds like a bit too much solder on the PWB, caused by too large a pad for the lead it will contain. In that case solder reduction is the way to move forward. What are the options there? 1. New stencil or stencils - (not desirable) 2. Increas


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