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Organic Flip Chip Packages for Use in Military and Aerospace Applications

Validity of the IPC R.O.S.E. Method 2.3.25 Researched

SMT Express, Volume 5, Issue No. 11 - from SMTnet.com

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

SMTnet Express - August 21, 2014

Advanced Solder Paste Dispensing

Advanced Solder Paste Dispensing

The Reliability Challenges of QFN Packaging

SMT Express, Volume 2, Issue No. 11 - from SMTnet.com

SMTnet Express - June 12, 2014

SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering