Used SMT Equipment | SPI / Solder Paste Inspection
Parmi Sigma X Inline 3D SPI for sale. - 2019 vintage - RSC 7 sensor head - 3 stage conveyor option (Max. 430 x 320mm) - PCB warpage inspection option - Mint condition For the details, please contact me anytime.
Used SMT Equipment | Screen Printers
Board Handling Specification Minimum Size 40 x 50mm Maximum Size 510 x 508mm Thickness 0.2mm - 6mm Maximum Weight 1Kg Warpage Up to 8mm including PCB thickness Underside Component Clearance Programmable 3mm - 42mm Transport Conveyors Programma
Industry News | 2017-08-14 18:57:16.0
Akrometrix will display its newest warpage metrology system in Booth #124 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The new Tabletop Shadow Moiré (TTSM) system responds to the industry’s demand for an ultra-fast tabletop warpage metrology system.
Industry News | 2017-06-29 18:37:43.0
Akrometrix is pleased to announce that it has launched its newest warpage metrology system – the Tabletop Shadow Moiré (TTSM) system.
New Equipment | Test Equipment
The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution o
New Equipment | Test Equipment
The AKM600P is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for wafers or panels up to 600 mm x 600 mm. With time-temperature profiling capa
Technical Library | 2014-08-19 15:39:13.0
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come.
Technical Library | 2008-03-13 13:02:50.0
Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique.
Industry News | 2016-04-29 12:00:45.0
Akrometrix today announced that the company has shipped its 300th shadow moiré metrology system to a leading back-end company in South Korea.
Industry News | 2016-05-05 20:15:12.0
Akrometrix today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology.
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