Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
Wire-bonding Technician: Capable of programming, repair and support automatic K&S 1419 wire bonders and MECH-EL /MEI manual bonders, among with other assy equipment. Familiarity with HYBRID assemblies in a semiconductors environment. SPC knowlege.
For Wire Bonding (Wedge and Ball Bonding)
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
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GTEK specializes in SMT, Thru Hole, prototypes; productions runs and rework assemblies for either consignment or turnkey. Also we have the capability of assembling & reworking BGA�s, doing wire bonding, cable/harness assemblies and designing your who
For remove residue on Wire Bonding (Ball Bonding) process
Spare parts for Wire Bonding (Ball Bonding) machine
Tool for Wire Bonding (Ball Bonding)
