Electronics Forum | Fri Jun 04 17:10:59 EDT 1999 | C.K.
| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI
Electronics Forum | Tue Jun 08 11:40:03 EDT 1999 | Steve Skinner
| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI
Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Fri Jul 14 14:46:59 EDT 2006 | Gman
Hello Folks, Has anyone come across this fascinating but undesirable surface appearance of BGA balls. I am not sure what it is called but I came across the term Black Island. To me it looks more like a disco ball. Lets just say the solder ball looks
Electronics Forum | Thu Jan 29 06:29:33 EST 2009 | sachu_70
There are two profiles available for the Pb-free process: (1) RSS and (2) RTS. In your case, you should try a solder paste that supports RTS profiles. A minimum of 7 zone Refow Oven would be fine on the Pb-free process. However, you may still try by
Electronics Forum | Mon Aug 24 11:17:19 EDT 2009 | stepheniii
Don't make that assumption. Once we had concerns about PCB's not matching what was ordered. I said "if we got HASL instead of ENIG, how do we know we got lead-free?" I mean if one thing got mixed up in translation, maybe two did. So we put a bare P
Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas
Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde
Electronics Forum | Wed Jul 22 13:50:49 EDT 1998 | Justin Medernach
| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board
Electronics Forum | Mon Mar 01 12:50:47 EST 1999 | justin medernach
| Hello! SMT professionals, | | I do not know if anyone posted this question before. | Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the hee
