Electronics Forum | Tue Jul 20 07:56:38 EDT 1999 | Mark Quealy
| | | I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's bu
Electronics Forum | Wed Jul 14 13:10:49 EDT 1999 | Earl Moon
| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it
Electronics Forum | Mon Jul 12 14:30:37 EDT 1999 | Earl Moon
| Hi all , | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | 1. Is underfill required for micro-BGAs? | | 2. What type of stencil apertures are the industry standards for uB
Electronics Forum | Tue Jul 13 13:28:18 EDT 1999 | Upinder Singh
| | Hi all , | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | 1. Is underfill required for micro-BGAs? | | | | 2. What type of stencil apertures are the industry st
Electronics Forum | Wed Jun 23 16:54:16 EDT 1999 | Frank Frimpong
| Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,eit
Electronics Forum | Wed Jun 16 22:04:16 EDT 1999 | Dean
| WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | CAN BOARDS BE
Electronics Forum | Sun Jun 06 08:00:06 EDT 1999 | Dave F
snip | Ryan, | | The only advive I got is just don't do it!. Dave's right the grain growth in it is pretty bad. the other thing you got to look at is how much heat is the board gonna produce in it's working life..??? and where is it gonna be used,
Electronics Forum | Mon Jun 07 07:31:59 EDT 1999 | tannlin
| Hi everybody, | | Somebody know the advantages of electroformed stencils on laser cut stencils ? | | any coment is apreciated. | | | thanks | | Al Al I have a quote for you from one of the major CEM's "anyone who thinks they are controllin
Electronics Forum | Fri May 21 04:03:46 EDT 1999 | Joe Manzur
John, Were doing an intrusive reflow process on a single sided board, where all the conventional parts are on the "top" of the board. Due to the nature of the board, and the kind of componets on it, we couldn't wave solder it. To keep it contai
Electronics Forum | Sun May 16 10:11:50 EDT 1999 | M Cox
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
