Electronics Forum | Fri Jun 29 14:13:05 EDT 2001 | markhoch
Just a quick thought on solder balls "or beads" caused when using NC paste. I found a spec (12.4.10 in IPC-A-610C) that says solder beads are acceptable if they are entrapped in NC flux residue and can not be dislodged in the normal service environme
Electronics Forum | Wed Jul 11 18:42:35 EDT 2001 | Darby
As I mentioned in the previous string we are happy with Electrolube "SSS". The guy who built our ulrasonic cleaners recommended it and it works very well. You don't have to change tanks or machines for a switch from paste to adhesive. It doesn't leav
Electronics Forum | Wed Jul 25 09:08:19 EDT 2001 | caldon
Our July 2000 empfasis article has a residue topic available for down load. http://www.empf.org (look under empfasis). Also, there are tons of Tech Pubs information available for down load via our web site as well. Caldon W. Driscoll ACI USA 610-36
Electronics Forum | Thu Feb 10 13:06:05 EST 2000 | Chris McDonald
Instead of spending 15k on a spray fluxer spend a little bit on your foam tower. The narrower the foam head the less flux being applied. You might have to modify the foam tower but if works. I would switch fluxes though there are others out there tha
Electronics Forum | Mon Dec 27 12:44:20 EST 1999 | jacob lacourse
If it's what I think it is you have a white residue on the legs of some of your fine pitch parts. We have came across this problem some time ago the way we eliminated this problem is to make sure your w/s solder and your liquid flux is compatible.
Electronics Forum | Fri Dec 03 15:38:13 EST 1999 | DaveH
Jason, Something which has not been addressed in the responses so far is the system which utilizes high volume (flow rate of chemistry over the product), versus high pressure, which indeed has the potential to damage very fine webs on fine pitch sten
Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris
Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is
Electronics Forum | Thu Oct 28 20:45:38 EDT 1999 | chris
Hi Dave, We suspect that the organic FM causes the non-wetting problem. FTIR analysis confirm that the FM is a flux residue. Dave we only used FTIR to detect organic contaminants, we also used SEM/EDX to determined the elemental composition of the
Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Mon Aug 09 04:15:33 EDT 1999 | Jacqueline Coia
I am having cleaning problems when processing PCB's which have TAIYO solder mask on them. After processing, hand soldering and cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other soldermasks do no
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